Investigation of defects in ultra-thin Al2O3 films deposited on pure copper by the atomic layer deposition technique: Fid-Bau Portal

Investigation of defects in ultra-thin Al2O3 films deposited on pure copper by the atomic layer deposition technique

Chang, M. L. / Wang, L. C. / Lin, H. C. / Chen, M. J. / Lin, K. M.

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Investigation of defects in ultra-thin Al2O3 films deposited on pure copper by the atomic layer deposition technique

Chang, M. L. / Wang, L. C. / Lin, H. C. / Chen, M. J. / Lin, K. M.

Investigation of defects in ultra-thin Al2O3 films deposited on pure copper by the atomic layer deposition technique

Chang, M. L. / Wang, L. C. / Lin, H. C. / Chen, M. J. / Lin, K. M.

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Document information

Title:

Investigation of defects in ultra-thin Al2O3 films deposited on pure copper by the atomic layer deposition technique

Contributors:

Chang, M. L. (author) / Wang, L. C. (author) / Lin, H. C. (author) / Chen, M. J. (author) / Lin, K. M. (author)

Published in:

APPLIED SURFACE SCIENCE ; 359 ; 533-542

Publication date:

2015-01-01

Size:

10 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

Chang, M.L. / Wang, L.C. / Lin, H.C. et al. | British Library Online Contents | 2015

Investigation of defects in ultra-thin Al2O3 films deposited on pure copper by the atomic layer deposition technique

Chang, M.L. / Wang, L.C. / Lin, H.C. et al. | British Library Online Contents | 2015

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Mattila, P. / Bosund, M. / Jussila, H. et al. | British Library Online Contents | 2014