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    Bonding Characteristics of Underfilled Ball Grid Array Packaging

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    Bonding Characteristics of Underfilled Ball Grid Array Packaging

    New search for: Yim, Byung-Seung
    New search for: Lee, Jeong Il
    New search for: Lee, Byung Hun
    New search for: Shin, Young-Eui
    New search for: Kim, Jong-Min

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Bonding Characteristics of Underfilled Ball Grid Array Packaging

    New search for: Yim, Byung-Seung
    New search for: Lee, Jeong Il
    New search for: Lee, Byung Hun
    New search for: Shin, Young-Eui
    New search for: Kim, Jong-Min

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Bonding Characteristics of Underfilled Ball Grid Array Packaging

    Contributors:

    Yim, Byung-Seung (author) / Lee, Jeong Il (author) / Lee, Byung Hun (author) / Shin, Young-Eui (author) / Kim, Jong-Min (author)

    Published in:

    Materials transactions ; 56 ; 974-980

    Publication date:

    2015-01-01

    Size:

    7 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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