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    Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows

    New search for: Shih, P.-C.
    New search for: Lin, K.-L.

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    Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows

    New search for: Shih, P.-C.
    New search for: Lin, K.-L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows

    New search for: Shih, P.-C.
    New search for: Lin, K.-L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows

    Contributors:

    Shih, P.-C. (author) / Lin, K.-L. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 219-229

    Publication date:

    2005-01-01

    Size:

    11 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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