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    Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging

    New search for: Luo, Hu
    New search for: Gan, Gui-sheng
    New search for: Du, Yunfei
    New search for: Yang, Donghua
    New search for: Wang, Huaishan
    New search for: Meng, Guoqi

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    Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging

    New search for: Luo, Hu
    New search for: Gan, Gui-sheng
    New search for: Du, Yunfei
    New search for: Yang, Donghua
    New search for: Wang, Huaishan
    New search for: Meng, Guoqi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging

    New search for: Luo, Hu
    New search for: Gan, Gui-sheng
    New search for: Du, Yunfei
    New search for: Yang, Donghua
    New search for: Wang, Huaishan
    New search for: Meng, Guoqi

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging

    Contributors:

    Luo, Hu (author) / Gan, Gui-sheng (author) / Du, Yunfei (author) / Yang, Donghua (author) / Wang, Huaishan (author) / Meng, Guoqi (author)

    Published in:

    Materials transactions ; 57 ; 833-837

    Publication date:

    2016-01-01

    Size:

    5 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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