Aging Treatment Characteristics of Shear Strength in Micro Solder Bump: Fid-Bau Portal

Aging Treatment Characteristics of Shear Strength in Micro Solder Bump

Yu, C.-H. / Kim, K.-S. / Sun, Y.-B. / Kim, N.-K. / Kim, N.-H. / Oh, H.-S. / Chang, E.-G.

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Aging Treatment Characteristics of Shear Strength in Micro Solder Bump

Yu, C.-H. / Kim, K.-S. / Sun, Y.-B. / Kim, N.-K. / Kim, N.-H. / Oh, H.-S. / Chang, E.-G.

Aging Treatment Characteristics of Shear Strength in Micro Solder Bump

Yu, C.-H. / Kim, K.-S. / Sun, Y.-B. / Kim, N.-K. / Kim, N.-H. / Oh, H.-S. / Chang, E.-G.

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Check availability in my library

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Document information

Title:

Aging Treatment Characteristics of Shear Strength in Micro Solder Bump

Contributors:

Yu, C.-H. (author) / Kim, K.-S. (author) / Sun, Y.-B. (author) / Kim, N.-K. (author) / Kim, N.-H. (author) / Oh, H.-S. (author) / Chang, E.-G. (author)

Published in:

MATERIALS TRANSACTIONS ; 43 ; 3234-3238

Publication date:

2002-01-01

Size:

5 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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