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    Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging

    New search for: Pang, H. L.
    New search for: Tan, K. H.
    New search for: Shi, X. Q.
    New search for: Wang, Z. P.

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    Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging

    New search for: Pang, H. L.
    New search for: Tan, K. H.
    New search for: Shi, X. Q.
    New search for: Wang, Z. P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging

    New search for: Pang, H. L.
    New search for: Tan, K. H.
    New search for: Shi, X. Q.
    New search for: Wang, Z. P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging

    Contributors:

    Pang, H. L. (author) / Tan, K. H. (author) / Shi, X. Q. (author) / Wang, Z. P. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 307 ; 42 - 50

    Publication date:

    2001-01-01

    Size:

    9 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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