Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Zinc Addition on Void Formation in Solid-Liquid Interdiffusion Bonding of Copper
Effect of Zinc Addition on Void Formation in Solid-Liquid Interdiffusion Bonding of Copper
Effect of Zinc Addition on Void Formation in Solid-Liquid Interdiffusion Bonding of Copper
Fukumoto, S. (Autor:in) / Miyazaki, T. (Autor:in) / Matsushima, M. (Autor:in) / Fujimoto, K. (Autor:in)
Materials transactions ; 57 ; 846-852
01.01.2016
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
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