Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder

    New search for: Mukherjee, S.
    New search for: Zhou, B.
    New search for: Dasgupta, A.
    New search for: Bieler, T.R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder

    New search for: Mukherjee, S.
    New search for: Zhou, B.
    New search for: Dasgupta, A.
    New search for: Bieler, T.R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder

    New search for: Mukherjee, S.
    New search for: Zhou, B.
    New search for: Dasgupta, A.
    New search for: Bieler, T.R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder

    Contributors:

    Mukherjee, S. (author) / Zhou, B. (author) / Dasgupta, A. (author) / Bieler, T.R. (author)

    Published in:

    International journal of plasticity ; 78 ; 1-25

    Publication date:

    2016-01-01

    Size:

    25 pages

    ISSN:

    0749-6419

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11233

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder

    Mukherjee, S. / Zhou, B. / Dasgupta, A. et al. | British Library Online Contents | 2016

    Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder

    Mukherjee, S. / Zhou, B. / Dasgupta, A. et al. | British Library Online Contents | 2016

    Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

    Wang, Y.L. / Dong, G.H. / Li, C.Y. et al. | British Library Online Contents | 2011

    Fatigue fracture of SnAgCu solder joints by microstructural modeling

    Erinc, M. / Assman, T. M. / Schreurs, P. J. et al. | British Library Online Contents | 2008

    Recrystallization behaviour of SnAgCu solder joints

    Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. | British Library Online Contents | 2008

    Back to top