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    Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball

    New search for: Hwang, Jun Ho
    New search for: Lee, Jong-Hyun

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    Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball

    New search for: Hwang, Jun Ho
    New search for: Lee, Jong-Hyun

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball

    New search for: Hwang, Jun Ho
    New search for: Lee, Jong-Hyun

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball

    Contributors:

    Hwang, Jun Ho (author) / Lee, Jong-Hyun (author)

    Published in:

    Applied surface science ; 454 ; 227-232

    Publication date:

    2018-01-01

    Size:

    6 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.44

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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