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    Research on parametric analysis for stress of Plastic Ball Grid Array solder joint under shock load

    New search for: Ping, Yang
    New search for: Jie, Zhang
    New search for: Dongyang, Wu
    New search for: Binghao, Bao

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    Research on parametric analysis for stress of Plastic Ball Grid Array solder joint under shock load

    New search for: Ping, Yang
    New search for: Jie, Zhang
    New search for: Dongyang, Wu
    New search for: Binghao, Bao

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Research on parametric analysis for stress of Plastic Ball Grid Array solder joint under shock load

    New search for: Ping, Yang
    New search for: Jie, Zhang
    New search for: Dongyang, Wu
    New search for: Binghao, Bao

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Research on parametric analysis for stress of Plastic Ball Grid Array solder joint under shock load

    Contributors:

    Ping, Yang (author) / Jie, Zhang (author) / Dongyang, Wu (author) / Binghao, Bao (author)

    Published in:

    International journal of material & product technology ; 31 ; 293-304

    Publication date:

    2008-01-01

    Size:

    12 pages

    ISSN:

    0268-1900

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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