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    Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    New search for: Mallik, S.
    New search for: Ekere, N.N.
    New search for: Durairaj, R.
    New search for: Marks, A.E.
    New search for: Seman, A.

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    Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    New search for: Mallik, S.
    New search for: Ekere, N.N.
    New search for: Durairaj, R.
    New search for: Marks, A.E.
    New search for: Seman, A.

    Access

    Check access
    Check availability in my library
    Order at Subito €

    Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    New search for: Mallik, S.
    New search for: Ekere, N.N.
    New search for: Durairaj, R.
    New search for: Marks, A.E.
    New search for: Seman, A.

    Access

    Check access
    Check availability in my library
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    Access

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    Document information
    Title:

    Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

    Additional title:

    Materials & Design

    Contributors:

    Mallik, S. (author) / Ekere, N.N. (author) / Durairaj, R. (author) / Marks, A.E. (author) / Seman, A. (author)

    Published in:

    Materials & Design ; 30 ; 4502-4506

    Publication date:

    2009-12-01

    ISSN:

    0261-3069

    DOI:

    https://doi.org/10.1016/j.matdes.2009.05.028

    Type of media:

    Article (Journal)

    Type of material:

    Electronic Resource

    Language:

    English

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