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Highlights ► 2.0wt.%TiB2/70Si–Al composite is prepared by a novel reactive technique. ► In situ TiB2 particles can refine effectively the primary Si phase. ► The composite exhibited attractive physical and mechanical properties.
Abstract A novel reactive technique has been employed in fabrication of 2.0wt.%TiB2/70Si–Al composite for electronic packaging applications. The microstructure and properties of composite were studied using scanning electron microscopy, energy dispersive X-ray spectrometer, coefficient of thermal expansion and thermal conductivity measurements, and 3-point bending tests. The results indicate that the in situ TiB2 particles can effectively refine the primary Si phase. The property measurements results indicate that the 2.0wt.%TiB2/70Si–Al composite has advantageous physical and mechanical properties, including low density, low coefficient of thermal expansion, high thermal conductivity, high Flexural strength and Brinell hardness.
Highlights ► 2.0wt.%TiB2/70Si–Al composite is prepared by a novel reactive technique. ► In situ TiB2 particles can refine effectively the primary Si phase. ► The composite exhibited attractive physical and mechanical properties.
Abstract A novel reactive technique has been employed in fabrication of 2.0wt.%TiB2/70Si–Al composite for electronic packaging applications. The microstructure and properties of composite were studied using scanning electron microscopy, energy dispersive X-ray spectrometer, coefficient of thermal expansion and thermal conductivity measurements, and 3-point bending tests. The results indicate that the in situ TiB2 particles can effectively refine the primary Si phase. The property measurements results indicate that the 2.0wt.%TiB2/70Si–Al composite has advantageous physical and mechanical properties, including low density, low coefficient of thermal expansion, high thermal conductivity, high Flexural strength and Brinell hardness.
Microstructure and property measurements on in situ TiB2/70Si–Al composite for electronic packaging applications
2011-10-24
5 pages
Article (Journal)
Electronic Resource
English
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