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Metal-ceramic bonded substrate and method for producing same
A metal-ceramic bonded substrate, which has excellent heat cycle resistance characteristics and excellent bonding strength between a ceramic substrate (10) that is formed of an aluminum nitride sintered body and a metal plate (14) that is formed of copper or a copper alloy, is produced by bonding the metal plate (14) to the ceramic substrate (10) after a wet blasting process with a brazing material (12) being interposed therebetween, said ceramic substrate (10) being obtained by the wet blasting process wherein a slurry that contains, as abrasive grains, spherical alumina in a liquid is jetted onto the surface of the ceramic substrate (10) so that: the ceramic substrate (10) has a residual stress of -50 MPa or less; the bonding surface of the ceramic substrate (10) bonded to the metal plate (14) has an arithmetic average roughness (Ra) of 0.15-0.30 [mu]m, a ten-point average roughness (Rz) of 0.7-1.1 [mu]m and a maximum height (Ry) of 0.9-1.7 [mu]m; the ceramic substrate (10) has a flexural strength of 500 MPa or less; and a residual stress layer (10a) that is formed along the surface of the ceramic substrate (10) has a thickness of 25 [mu]m or less.
Metal-ceramic bonded substrate and method for producing same
A metal-ceramic bonded substrate, which has excellent heat cycle resistance characteristics and excellent bonding strength between a ceramic substrate (10) that is formed of an aluminum nitride sintered body and a metal plate (14) that is formed of copper or a copper alloy, is produced by bonding the metal plate (14) to the ceramic substrate (10) after a wet blasting process with a brazing material (12) being interposed therebetween, said ceramic substrate (10) being obtained by the wet blasting process wherein a slurry that contains, as abrasive grains, spherical alumina in a liquid is jetted onto the surface of the ceramic substrate (10) so that: the ceramic substrate (10) has a residual stress of -50 MPa or less; the bonding surface of the ceramic substrate (10) bonded to the metal plate (14) has an arithmetic average roughness (Ra) of 0.15-0.30 [mu]m, a ten-point average roughness (Rz) of 0.7-1.1 [mu]m and a maximum height (Ry) of 0.9-1.7 [mu]m; the ceramic substrate (10) has a flexural strength of 500 MPa or less; and a residual stress layer (10a) that is formed along the surface of the ceramic substrate (10) has a thickness of 25 [mu]m or less.
Metal-ceramic bonded substrate and method for producing same
OSANAI HIDEYO (author) / KITAMURA YUKIHIRO (author) / AOKI HIROTO (author) / KANECHIKA YUKIHIRO (author) / SUGAWARA KEN (author) / TAKEDA YASUKO (author)
2015-07-22
Patent
Electronic Resource
English
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