A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METAL-CERAMIC BONDED SUBSTRATE, AND METHOD OF PRODUCING THE SAME
To provide a metal-ceramic bonded substrate constituted of a circuit-pattern aluminum plate which is directly bonded to one face of a ceramic substrate apart from an aluminum base plate directly bonded to approximately the whole of the peripheral part of one face, the side face and the other face of the ceramic substrate, and a method of producing the same.SOLUTION: A ceramic substrate 10 is arranged in a mold 20 in a manner of extending approximately in the horizontal direction, and molten aluminum or a molten aluminum alloy is poured thereinto so as to contact with the surface of the ceramic substrate, is subsequently cooled, and is solidified, whereby an aluminum base plate is formed on approximately the whole of the peripheral part of the upper face, the side face, and the bottom face of the ceramic substrate and is directly bonded to the ceramic substrate, and a circuit-pattern aluminum plate is formed on the upper face of the ceramic substrate apart from the base plate and is directly bonded to the ceramic substrate.SELECTED DRAWING: Figure 2A
【課題】セラミックス基板の一方の面の周縁部と側面および他方の面の略全面に直接接合したアルミニウムベース板から離間して回路パターン用アルミニウム板がセラミックス基板の一方の面に直接接合した、金属−セラミックス接合基板およびその製造方法を提供する。【解決手段】鋳型２０内に略水平方向に延びるようにセラミックス基板１０を配置し、このセラミックス基板の表面に接触するようにアルミニウムまたはアルミニウム合金の溶湯を注湯した後に溶湯を冷却して固化させることにより、アルミニウムベース板をセラミックス基板の上面の周縁部と側面および底面の略全面に形成してセラミックス基板に直接接合させるとともに、回路パターン用アルミニウム板をベース板から離間してセラミックス基板の上面に形成してセラミックス基板に直接接合させる。【選択図】図２Ａ
METAL-CERAMIC BONDED SUBSTRATE, AND METHOD OF PRODUCING THE SAME
To provide a metal-ceramic bonded substrate constituted of a circuit-pattern aluminum plate which is directly bonded to one face of a ceramic substrate apart from an aluminum base plate directly bonded to approximately the whole of the peripheral part of one face, the side face and the other face of the ceramic substrate, and a method of producing the same.SOLUTION: A ceramic substrate 10 is arranged in a mold 20 in a manner of extending approximately in the horizontal direction, and molten aluminum or a molten aluminum alloy is poured thereinto so as to contact with the surface of the ceramic substrate, is subsequently cooled, and is solidified, whereby an aluminum base plate is formed on approximately the whole of the peripheral part of the upper face, the side face, and the bottom face of the ceramic substrate and is directly bonded to the ceramic substrate, and a circuit-pattern aluminum plate is formed on the upper face of the ceramic substrate apart from the base plate and is directly bonded to the ceramic substrate.SELECTED DRAWING: Figure 2A
【課題】セラミックス基板の一方の面の周縁部と側面および他方の面の略全面に直接接合したアルミニウムベース板から離間して回路パターン用アルミニウム板がセラミックス基板の一方の面に直接接合した、金属−セラミックス接合基板およびその製造方法を提供する。【解決手段】鋳型２０内に略水平方向に延びるようにセラミックス基板１０を配置し、このセラミックス基板の表面に接触するようにアルミニウムまたはアルミニウム合金の溶湯を注湯した後に溶湯を冷却して固化させることにより、アルミニウムベース板をセラミックス基板の上面の周縁部と側面および底面の略全面に形成してセラミックス基板に直接接合させるとともに、回路パターン用アルミニウム板をベース板から離間してセラミックス基板の上面に形成してセラミックス基板に直接接合させる。【選択図】図２Ａ
METAL-CERAMIC BONDED SUBSTRATE, AND METHOD OF PRODUCING THE SAME
金属−セラミックス接合基板およびその製造方法
IDEGUCHI SATORU (author)
2020-04-02
Patent
Electronic Resource
Japanese
Metal-ceramic bonded substrate and method for producing same
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