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Niobium oxide sputtering target, production method therefor, and niobium oxide film
The present invention provides a niobium oxide sputtering target that enables direct current (DC) sputtering, and also provides a production method and an niobium oxide film. This niobium oxide sputtering target is characterized by being a niobium oxide sintered body and in that the specific resistance thereof is 0.001-0.05 [Omega]cm over the entire area of the sintered body in the thickness direction.
Niobium oxide sputtering target, production method therefor, and niobium oxide film
The present invention provides a niobium oxide sputtering target that enables direct current (DC) sputtering, and also provides a production method and an niobium oxide film. This niobium oxide sputtering target is characterized by being a niobium oxide sintered body and in that the specific resistance thereof is 0.001-0.05 [Omega]cm over the entire area of the sintered body in the thickness direction.
Niobium oxide sputtering target, production method therefor, and niobium oxide film
UMEMOTO KEITA (author) / ZHANG SHOUBIN (author)
2015-11-18
Patent
Electronic Resource
English
NIOBIUM OXIDE SPUTTERING TARGET, PRODUCTION METHOD THEREFOR, AND NIOBIUM OXIDE FILM
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