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Manufacturing method for ceramic-based copper-clad plate
The invention discloses a manufacturing method for a ceramic-based copper-clad plate. The method comprises the following steps: cleaning of a ceramic substrate; ion beam cleaning and activation; metal ion implantation; vacuum coating; and thickening of a copper film through electroplating. The following two film systems can be adopted: (1) metal sedimentary deposit/copper sedimentary deposit; and (2) metal oxide sedimentary deposit/metal sedimentary deposit/copper sedimentary deposit. The manufacturing method has the advantages of high production efficiency, stable quality and low cost; and the manufactured ceramic-based copper-clad plate has the characteristics of low porosity, high thermal conductivity, high peeling strength, good stability, etc.
Manufacturing method for ceramic-based copper-clad plate
The invention discloses a manufacturing method for a ceramic-based copper-clad plate. The method comprises the following steps: cleaning of a ceramic substrate; ion beam cleaning and activation; metal ion implantation; vacuum coating; and thickening of a copper film through electroplating. The following two film systems can be adopted: (1) metal sedimentary deposit/copper sedimentary deposit; and (2) metal oxide sedimentary deposit/metal sedimentary deposit/copper sedimentary deposit. The manufacturing method has the advantages of high production efficiency, stable quality and low cost; and the manufactured ceramic-based copper-clad plate has the characteristics of low porosity, high thermal conductivity, high peeling strength, good stability, etc.
Manufacturing method for ceramic-based copper-clad plate
ZHU TUFU (author) / DAN MIN (author) / JIN FANYA (author) / SHEN LIRU (author) / TONG HONGHUI (author) / XIE XINLIN (author) / GAO MINGZHI (author) / YANG NIANQUN (author)
2015-12-16
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
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