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A platform for research: civil engineering, architecture and urbanism
Manufacturing method of ceramic-based copper-clad plate and product thereof
The invention relates to a manufacturing method of a ceramic-based copper-clad plate and a product thereof. The manufacturing method comprises the following steps: (1) polishing and cleaning the surface of a ceramic base material; (2) carrying out metallization treatment on the upper surface and the lower surface of the ceramic base material by adopting a vapor deposition process technology, and forming a compact metallization intermediate layer on the surface of the ceramic base material; (3) carrying out copper plating thickening treatment on the metalized intermediate layer by adopting an electroplating process; (4) performing high-temperature diffusion welding after the treated ceramic base material and the copper foil are attached and pressed; and (5) cooling to obtain the ceramic-based copper-clad plate. The ceramic-based copper-clad plate with large copper foil size and thickness prepared by the method has high peel strength, and can be used for high-reliability packaging of a high-power module.
本发明涉及一种陶瓷基覆铜板的制造方法及其产品，包括：（1）将陶瓷基材进行表面打磨清洗；（2）采用气相沉积的工艺技术将陶瓷基材上下表面进行金属化处理，在陶瓷基材表面形成一层致密的金属化中间层；（3）将金属化中间层采用电镀的工艺进行镀铜增厚处理；（4）把处理好的陶瓷基材与铜箔贴合压紧后进行高温扩散焊接；（5）冷却后得到陶瓷基覆铜板。通过本发明方法制备的铜箔尺寸厚度大的陶瓷基覆铜板具有高剥离强度，可用于大功率模块的高可靠性封装。
Manufacturing method of ceramic-based copper-clad plate and product thereof
The invention relates to a manufacturing method of a ceramic-based copper-clad plate and a product thereof. The manufacturing method comprises the following steps: (1) polishing and cleaning the surface of a ceramic base material; (2) carrying out metallization treatment on the upper surface and the lower surface of the ceramic base material by adopting a vapor deposition process technology, and forming a compact metallization intermediate layer on the surface of the ceramic base material; (3) carrying out copper plating thickening treatment on the metalized intermediate layer by adopting an electroplating process; (4) performing high-temperature diffusion welding after the treated ceramic base material and the copper foil are attached and pressed; and (5) cooling to obtain the ceramic-based copper-clad plate. The ceramic-based copper-clad plate with large copper foil size and thickness prepared by the method has high peel strength, and can be used for high-reliability packaging of a high-power module.
本发明涉及一种陶瓷基覆铜板的制造方法及其产品，包括：（1）将陶瓷基材进行表面打磨清洗；（2）采用气相沉积的工艺技术将陶瓷基材上下表面进行金属化处理，在陶瓷基材表面形成一层致密的金属化中间层；（3）将金属化中间层采用电镀的工艺进行镀铜增厚处理；（4）把处理好的陶瓷基材与铜箔贴合压紧后进行高温扩散焊接；（5）冷却后得到陶瓷基覆铜板。通过本发明方法制备的铜箔尺寸厚度大的陶瓷基覆铜板具有高剥离强度，可用于大功率模块的高可靠性封装。
Manufacturing method of ceramic-based copper-clad plate and product thereof
一种陶瓷基覆铜板的制造方法及其产品
MA FENGLING (author) / JIN SHILEI (author) / LI XIAOHUI (author) / SHEN SHILIN (author) / LI FENG (author) / WANG JUN (author)
2023-01-20
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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