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Eutectic welding method for upper box dam of aluminum oxide ceramic substrate
The invention discloses a eutectic welding method for an upper box dam of an aluminum oxide ceramic substrate. The eutectic welding method comprises the following steps of: step 1, printing a metal circuit coating on an aluminum oxide ceramic substrate through a thick film printing technology, wherein the shape of the metal circuit coating is matched with the shape of a box dam, which needs to bewelded on the aluminum oxide ceramic substrate; step 2, putting the aluminum oxide ceramic substrate and the box dam into an eutectic welding device; step 3, printing or placing alloy solder on the metal circuit coating on the aluminum oxide ceramic substrate, then printing or placing the box dam on the aluminum oxide ceramic substrate with the alloy solder arranged between the box dam and the aluminum oxide ceramic substrate, wherein the box dam corresponds to the metal circuit coating in shape; step 4, starting the eutectic welding device for welding, wherein the welding temperature ranges from 150 DEG C to 500 DEG C; and step 5, completing the welding. The eutectic welding mode is adopted for box dam welding of the aluminum oxide ceramic, compared with magnetron sputtering in the priorart, the operation is more convenient, and the cost is lower.
本发明公开了一种氧化铝陶瓷基板上围坝的共晶焊接方法，包括如下步骤：第一步，将氧化铝陶瓷基板通过厚膜印刷技术印刷出金属线路涂层，该金属线路涂层形状与需要焊接到氧化铝陶瓷上的围坝的形状适配；第二步，将所述氧化铝陶瓷基板和所述围坝放入到共晶焊接装置中；第三步，在所述氧化铝陶瓷基板的金属线路涂层上印刷或放置合金焊料，再将所述围坝隔着所述合金焊料印刷或放置到所述氧化铝陶瓷基板上，所述围坝与所述金属线路涂层的形状对应；第四步，启动所述共晶焊接装置进行焊接，且焊接的温度为150℃‑500℃；第五步，焊接完成。本发明针对氧化铝陶瓷的围坝焊接采用共晶焊接的方式进行焊接，相对于现有技术中采用磁控溅射，更加方便操作，成本更低。
Eutectic welding method for upper box dam of aluminum oxide ceramic substrate
The invention discloses a eutectic welding method for an upper box dam of an aluminum oxide ceramic substrate. The eutectic welding method comprises the following steps of: step 1, printing a metal circuit coating on an aluminum oxide ceramic substrate through a thick film printing technology, wherein the shape of the metal circuit coating is matched with the shape of a box dam, which needs to bewelded on the aluminum oxide ceramic substrate; step 2, putting the aluminum oxide ceramic substrate and the box dam into an eutectic welding device; step 3, printing or placing alloy solder on the metal circuit coating on the aluminum oxide ceramic substrate, then printing or placing the box dam on the aluminum oxide ceramic substrate with the alloy solder arranged between the box dam and the aluminum oxide ceramic substrate, wherein the box dam corresponds to the metal circuit coating in shape; step 4, starting the eutectic welding device for welding, wherein the welding temperature ranges from 150 DEG C to 500 DEG C; and step 5, completing the welding. The eutectic welding mode is adopted for box dam welding of the aluminum oxide ceramic, compared with magnetron sputtering in the priorart, the operation is more convenient, and the cost is lower.
本发明公开了一种氧化铝陶瓷基板上围坝的共晶焊接方法，包括如下步骤：第一步，将氧化铝陶瓷基板通过厚膜印刷技术印刷出金属线路涂层，该金属线路涂层形状与需要焊接到氧化铝陶瓷上的围坝的形状适配；第二步，将所述氧化铝陶瓷基板和所述围坝放入到共晶焊接装置中；第三步，在所述氧化铝陶瓷基板的金属线路涂层上印刷或放置合金焊料，再将所述围坝隔着所述合金焊料印刷或放置到所述氧化铝陶瓷基板上，所述围坝与所述金属线路涂层的形状对应；第四步，启动所述共晶焊接装置进行焊接，且焊接的温度为150℃‑500℃；第五步，焊接完成。本发明针对氧化铝陶瓷的围坝焊接采用共晶焊接的方式进行焊接，相对于现有技术中采用磁控溅射，更加方便操作，成本更低。
Eutectic welding method for upper box dam of aluminum oxide ceramic substrate
氧化铝陶瓷基板上围坝的共晶焊接方法
ZHOU KONGLI (author)
2020-11-13
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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