A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Semiconductor heat treatment equipment
The invention provides semiconductor heat treatment equipment. The semiconductor heat treatment equipment comprises a process chamber and a sealing door, the sealing door is used for being attached to the process chamber so as to seal the process chamber and comprises a door body, a connecting part, a supporting assembly and an adjusting assembly, the connecting part is arranged opposite to a door body and is connected to the supporting assembly and the adjusting assembly, the supporting assembly penetrates through the door body, is connected to the door body in a sealed mode and can move in the direction, opposite to the door body, of the connecting part so as to drive the adjusting assembly through the connecting part to press the door body, and the adjusting assembly is connected to the door body in a rotating mode and is used for realizing attachment of the door body and the process cavity. According to the semiconductor heat treatment equipment, the sealing performance of the process chamber can be improved.
本发明提供一种半导体热处理设备，包括工艺腔室和密封门，密封门用于与工艺腔室贴合，以对工艺腔室进行密封，密封门包括门体、连接部件、支撑组件和调节组件，其中，连接部件与门体相对设置，并分别与支撑组件和调节组件连接；支撑组件贯穿门体，并与门体密封连接，且可在连接部件与门体相对的方向上移动，以通过连接部件带动调节组件压紧门体；调节组件与门体可转动的连接，用于实现门体与工艺腔室的贴合。本发明提供的半导体热处理设备能够提高工艺腔室的密封性。
Semiconductor heat treatment equipment
The invention provides semiconductor heat treatment equipment. The semiconductor heat treatment equipment comprises a process chamber and a sealing door, the sealing door is used for being attached to the process chamber so as to seal the process chamber and comprises a door body, a connecting part, a supporting assembly and an adjusting assembly, the connecting part is arranged opposite to a door body and is connected to the supporting assembly and the adjusting assembly, the supporting assembly penetrates through the door body, is connected to the door body in a sealed mode and can move in the direction, opposite to the door body, of the connecting part so as to drive the adjusting assembly through the connecting part to press the door body, and the adjusting assembly is connected to the door body in a rotating mode and is used for realizing attachment of the door body and the process cavity. According to the semiconductor heat treatment equipment, the sealing performance of the process chamber can be improved.
本发明提供一种半导体热处理设备，包括工艺腔室和密封门，密封门用于与工艺腔室贴合，以对工艺腔室进行密封，密封门包括门体、连接部件、支撑组件和调节组件，其中，连接部件与门体相对设置，并分别与支撑组件和调节组件连接；支撑组件贯穿门体，并与门体密封连接，且可在连接部件与门体相对的方向上移动，以通过连接部件带动调节组件压紧门体；调节组件与门体可转动的连接，用于实现门体与工艺腔室的贴合。本发明提供的半导体热处理设备能够提高工艺腔室的密封性。
Semiconductor heat treatment equipment
半导体热处理设备
ZHU WANGPING (author) / WANG XIAOFEI (author)
2021-08-03
Patent
Electronic Resource
Chinese
IPC:
E06B
Feste oder bewegliche Abschlüsse für Öffnungen in Bauwerken, Fahrzeugen, Zäunen oder ähnlichen Einfriedungen allgemein, z.B. Türen, Fenster, Läden, Tore
,
FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES, OR LIKE ENCLOSURES, IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
E05C
Riegel oder Feststellvorrichtungen für Flügel, insbesondere für Türen oder Fenster
,
BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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