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A platform for research: civil engineering, architecture and urbanism
Semiconductor process equipment
The invention discloses semiconductor process equipment, which comprises a loading chamber and a sealing device, the chamber wall of the loading chamber is provided with an opening, the sealing device is used for sealing the opening, and the sealing device comprises a sealing door assembly, a first driving mechanism, a second driving mechanism and an adjusting mechanism, the first driving mechanism is connected with the sealing door assembly and used for driving the sealing door assembly to move to the position opposite to or staggered from the opening. The second driving mechanism is arranged on the chamber wall and is used for driving the sealing door assembly to press the chamber wall when the sealing door assembly is opposite to the opening; the adjusting mechanism is arranged on the sealing door assembly and used for adjusting the parallelism of the sealing door assembly relative to the cavity wall so that the sealing door assembly can seal the opening. According to the scheme, the problem that the sealing door assembly cannot tightly seal the opening due to the fact that the sealing door assembly is poor in parallelism relative to the cavity wall can be solved.
本申请公开一种半导体工艺设备，包括装载腔室和密封装置，所述装载腔室的腔室壁具有开口，所述密封装置用于对所述开口密封，所述密封装置包括密封门组件、第一驱动机构、第二驱动机构和调节机构，其中：所述第一驱动机构与所述密封门组件连接，用于驱动所述密封门组件移动至与所述开口相对或错位的位置；所述第二驱动机构设置在所述腔室壁上，用于在所述密封门组件与所述开口相对时，驱动所述密封门组件压紧所述腔室壁；所述调节机构设于所述密封门组件，用于调整所述密封门组件相对于所述腔室壁的平行度，以使所述密封门组件对所述开口密封。上述方案可以解决密封门组件相对于腔室壁平行度较差，而导致密封门组件对开口密封不严的问题。
Semiconductor process equipment
The invention discloses semiconductor process equipment, which comprises a loading chamber and a sealing device, the chamber wall of the loading chamber is provided with an opening, the sealing device is used for sealing the opening, and the sealing device comprises a sealing door assembly, a first driving mechanism, a second driving mechanism and an adjusting mechanism, the first driving mechanism is connected with the sealing door assembly and used for driving the sealing door assembly to move to the position opposite to or staggered from the opening. The second driving mechanism is arranged on the chamber wall and is used for driving the sealing door assembly to press the chamber wall when the sealing door assembly is opposite to the opening; the adjusting mechanism is arranged on the sealing door assembly and used for adjusting the parallelism of the sealing door assembly relative to the cavity wall so that the sealing door assembly can seal the opening. According to the scheme, the problem that the sealing door assembly cannot tightly seal the opening due to the fact that the sealing door assembly is poor in parallelism relative to the cavity wall can be solved.
本申请公开一种半导体工艺设备，包括装载腔室和密封装置，所述装载腔室的腔室壁具有开口，所述密封装置用于对所述开口密封，所述密封装置包括密封门组件、第一驱动机构、第二驱动机构和调节机构，其中：所述第一驱动机构与所述密封门组件连接，用于驱动所述密封门组件移动至与所述开口相对或错位的位置；所述第二驱动机构设置在所述腔室壁上，用于在所述密封门组件与所述开口相对时，驱动所述密封门组件压紧所述腔室壁；所述调节机构设于所述密封门组件，用于调整所述密封门组件相对于所述腔室壁的平行度，以使所述密封门组件对所述开口密封。上述方案可以解决密封门组件相对于腔室壁平行度较差，而导致密封门组件对开口密封不严的问题。
Semiconductor process equipment
半导体工艺设备
CHENG CHEN (author) / SONG XINFENG (author) / YANG SHUAI (author)
2023-02-03
Patent
Electronic Resource
Chinese
IPC:
E06B
Feste oder bewegliche Abschlüsse für Öffnungen in Bauwerken, Fahrzeugen, Zäunen oder ähnlichen Einfriedungen allgemein, z.B. Türen, Fenster, Läden, Tore
,
FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES, OR LIKE ENCLOSURES, IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
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