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METAL-CERAMIC JOINED SUBSTRATE AND MANUFACTURING METHOD THEREOF
Provided are a metal/ceramic joined substrate in which the joining strength of an aluminum plate directly joined to a ceramic substrate is higher than in prior art, and a method for manufacturing the same. A metal-ceramic joined substrate is manufactured by placing a ceramic substrate 10 in a mold 20, placing the mold 20 into the furnace, reducing the oxygen concentration in the furnace to 25 ppm or less and lowering the dew point to -45 DEG C or lower, bringing the aluminum melt into contact with the surface of the ceramic substrate 10, and then cooling and solidifying the melt to form a circuit pattern metal plate 14 made of aluminum on one surface of the ceramic substrate 10 and directly joining one surface of the circuit pattern metal plate 14 to the ceramic substrate 10, and also forming a metal base plate 12 made of aluminum on the other surface of the ceramic substrate 10 and directly joining the metal base plate to the ceramic substrate 10.
本发明提供一种直接接合于陶瓷基板的铝板的接合强度高于以往的金属－陶瓷接合基板及其制造方法。在铸模20内配置陶瓷基板10，将铸模20放入炉内，使炉内的氧浓度降至25ppm以下、露点降至－45℃以下，以接触陶瓷基板10的表面的方式注入铝熔融液后冷却熔融液使其固化，藉此在陶瓷基板10的一面形成由铝形成的电路图案用金属板14板而使该电路图案用金属板14的一面与陶瓷基板10直接接合，同时在陶瓷基板10的另一面形成由铝形成的金属基板12而使其与陶瓷基板10直接接合，从而制得金属－陶瓷接合基板。
METAL-CERAMIC JOINED SUBSTRATE AND MANUFACTURING METHOD THEREOF
Provided are a metal/ceramic joined substrate in which the joining strength of an aluminum plate directly joined to a ceramic substrate is higher than in prior art, and a method for manufacturing the same. A metal-ceramic joined substrate is manufactured by placing a ceramic substrate 10 in a mold 20, placing the mold 20 into the furnace, reducing the oxygen concentration in the furnace to 25 ppm or less and lowering the dew point to -45 DEG C or lower, bringing the aluminum melt into contact with the surface of the ceramic substrate 10, and then cooling and solidifying the melt to form a circuit pattern metal plate 14 made of aluminum on one surface of the ceramic substrate 10 and directly joining one surface of the circuit pattern metal plate 14 to the ceramic substrate 10, and also forming a metal base plate 12 made of aluminum on the other surface of the ceramic substrate 10 and directly joining the metal base plate to the ceramic substrate 10.
本发明提供一种直接接合于陶瓷基板的铝板的接合强度高于以往的金属－陶瓷接合基板及其制造方法。在铸模20内配置陶瓷基板10，将铸模20放入炉内，使炉内的氧浓度降至25ppm以下、露点降至－45℃以下，以接触陶瓷基板10的表面的方式注入铝熔融液后冷却熔融液使其固化，藉此在陶瓷基板10的一面形成由铝形成的电路图案用金属板14板而使该电路图案用金属板14的一面与陶瓷基板10直接接合，同时在陶瓷基板10的另一面形成由铝形成的金属基板12而使其与陶瓷基板10直接接合，从而制得金属－陶瓷接合基板。
METAL-CERAMIC JOINED SUBSTRATE AND MANUFACTURING METHOD THEREOF
金属－陶瓷接合基板及其制造方法
OSANAI HIDEYO (author)
2021-09-28
Patent
Electronic Resource
Chinese
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