A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Composite board with electromagnetic shielding function and composite floor thereof
The embodiment of the invention discloses a composite board with an electromagnetic shielding function and a composite floor thereof, and the composite board is a compression layer composed of a first material and a second material, and comprises a functional layer which is located on a core layer and is formed by mixing and compressing the first material and the second material, the leveling layers are positioned above and below the functional layer and are formed by compressing the second material; the functional layer is suitable for providing electromagnetic shielding through the first material, and the thickness of the functional layer is 0.5-1.0 mm; the leveling layer is suitable for providing a gluing plane, and the thickness of the leveling layer ranges from 0.2 mm to 1.0 mm.
本申请实施例公开了一种具有电磁屏蔽功能的复合板及其复合地板，所述复合板是由第一材料和第二材料组成的压缩层，包括位于芯层且由所述第一材料、所述第二材料混合压缩形成的功能层，和位于所述功能层之上和之下且由所述第二材料压缩形成的整平层；所述功能层通过所述第一材料从而适用于提供电磁屏蔽，所述功能层的厚度为0.5～1.0mm；所述整平层适用于提供胶合平面，所述整平层的厚度为0.2～1.0mm。
Composite board with electromagnetic shielding function and composite floor thereof
The embodiment of the invention discloses a composite board with an electromagnetic shielding function and a composite floor thereof, and the composite board is a compression layer composed of a first material and a second material, and comprises a functional layer which is located on a core layer and is formed by mixing and compressing the first material and the second material, the leveling layers are positioned above and below the functional layer and are formed by compressing the second material; the functional layer is suitable for providing electromagnetic shielding through the first material, and the thickness of the functional layer is 0.5-1.0 mm; the leveling layer is suitable for providing a gluing plane, and the thickness of the leveling layer ranges from 0.2 mm to 1.0 mm.
本申请实施例公开了一种具有电磁屏蔽功能的复合板及其复合地板，所述复合板是由第一材料和第二材料组成的压缩层，包括位于芯层且由所述第一材料、所述第二材料混合压缩形成的功能层，和位于所述功能层之上和之下且由所述第二材料压缩形成的整平层；所述功能层通过所述第一材料从而适用于提供电磁屏蔽，所述功能层的厚度为0.5～1.0mm；所述整平层适用于提供胶合平面，所述整平层的厚度为0.2～1.0mm。
Composite board with electromagnetic shielding function and composite floor thereof
具有电磁屏蔽功能的复合板及其复合地板
WANG WENBIN (author) / DOU QINGQING (author) / CHEN LONG (author) / LONG ZHIGANG (author) / LIU XING (author) / ZHAO XIANG (author) / DING XUEPING (author) / LUO GUANMEI (author) / ZHANG ZHEN (author) / LI JUN (author)
2023-03-03
Patent
Electronic Resource
Chinese
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
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Ausbau von Bauwerken, z.B. Treppen, Fußböden
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