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Copper-ceramic bonded body and insulated circuit board
This copper-ceramic bonded body (10) is obtained by bonding copper members (12, 13) comprising copper or a copper alloy and a ceramic member (11), and the area ratio of Ag solid solution parts (12A, 13A) having an Ag concentration of 0.5-15 mass% in an end region (E) of the copper members (12, 13) is within the range of 0.03-0.35.
本发明的铜‑陶瓷接合体为通过接合由铜或铜合金构成的铜部件(12，13)和陶瓷部件(11)而成的铜‑陶瓷接合体(10)，在铜部件(12，13)的端部区域(E)中，Ag浓度为0.5质量％以上且15质量％以下的Ag固溶部(12A，13A)的面积比在0.03以上且0.35以下的范围内。
Copper-ceramic bonded body and insulated circuit board
This copper-ceramic bonded body (10) is obtained by bonding copper members (12, 13) comprising copper or a copper alloy and a ceramic member (11), and the area ratio of Ag solid solution parts (12A, 13A) having an Ag concentration of 0.5-15 mass% in an end region (E) of the copper members (12, 13) is within the range of 0.03-0.35.
本发明的铜‑陶瓷接合体为通过接合由铜或铜合金构成的铜部件(12，13)和陶瓷部件(11)而成的铜‑陶瓷接合体(10)，在铜部件(12，13)的端部区域(E)中，Ag浓度为0.5质量％以上且15质量％以下的Ag固溶部(12A，13A)的面积比在0.03以上且0.35以下的范围内。
Copper-ceramic bonded body and insulated circuit board
铜-陶瓷接合体及绝缘电路基板
TERASAKI NOBUYUKI (author)
2024-04-16
Patent
Electronic Resource
Chinese