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Copper-ceramic bonded substrate and method for manufacturing same
This copper-ceramic bonded substrate is provided with: a ceramic substrate; and a copper plate bonded to at least one surface of the ceramic substrate, the Vickers hardness of the copper plate being 42.5 HV or less, the content of magnesium in the copper plate being 1 ppm or less, the content of nickel being 2.5 ppm or less, the content of tin being 0.05 ppm or less, the content of selenium being 0.3 ppm or less, the content of tellurium being 0.07 ppm or less, and the content of bismuth being 0.2 ppm or less.
一种铜‑陶瓷接合基板，其具备：陶瓷基板；以及接合于陶瓷基板的至少一个面的铜板，铜板的维氏硬度为42.5HV以下，铜板中的镁的含量为1ppm以下，镍的含量为2.5ppm以下，锡的含量为0.05ppm以下，硒的含量为0.3ppm以下，碲的含量为0.07ppm以下，铋的含量为0.2ppm以下。
Copper-ceramic bonded substrate and method for manufacturing same
This copper-ceramic bonded substrate is provided with: a ceramic substrate; and a copper plate bonded to at least one surface of the ceramic substrate, the Vickers hardness of the copper plate being 42.5 HV or less, the content of magnesium in the copper plate being 1 ppm or less, the content of nickel being 2.5 ppm or less, the content of tin being 0.05 ppm or less, the content of selenium being 0.3 ppm or less, the content of tellurium being 0.07 ppm or less, and the content of bismuth being 0.2 ppm or less.
一种铜‑陶瓷接合基板，其具备：陶瓷基板；以及接合于陶瓷基板的至少一个面的铜板，铜板的维氏硬度为42.5HV以下，铜板中的镁的含量为1ppm以下，镍的含量为2.5ppm以下，锡的含量为0.05ppm以下，硒的含量为0.3ppm以下，碲的含量为0.07ppm以下，铋的含量为0.2ppm以下。
Copper-ceramic bonded substrate and method for manufacturing same
铜-陶瓷接合基板及其制造方法
YUKI SEIYA (author) / TERAMOTO YUKI (author)
2024-10-01
Patent
Electronic Resource
Chinese
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