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ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
To provide an aluminum-ceramic bonded substrate and method for manufacturing same capable of making aluminum crystal grains fine while maintaining the electric conductivity and Vickers hardness of an aluminum plate to be bonded to a ceramic substrate.SOLUTION: An aluminum-ceramic bonded substrate is manufactured by heating and fusing the solid aluminum and solid Al-Ti-B alloy inputted into a molten-metal holding furnace to obtain a molten metal containing 0.01-0.2 mass% of Ti and 0.001-0.1 mass% of B with a remainder consisting of Al and inevitable impurities, and pouring the molten metal into a mold 10 in a manner contacting one surface of a ceramic substrate arranged therein and thereafter cooling and solidifying it, thereby forming and directly joining an aluminum circuit plate on one surface of the ceramic substrate.SELECTED DRAWING: Figure 1
【課題】セラミックス基板に接合するアルミニウム板の導電率とビッカース硬さを維持しながらアルミニウムの結晶粒を微細化することができる、アルミニウム−セラミックス接合基板およびその製造方法を提供する。【解決手段】溶湯保持炉内に投入した固体のアルミニウムと固体のＡｌ−Ｔｉ−Ｂ合金を加熱して溶融させて、０．０１〜０．２質量％のＴｉと０．００１〜０．１質量％のＢを含み、残部がＡｌと不可避不純物からなる溶湯を得た後、この溶湯を、鋳型１０内に配置されたセラミックス基板の一方の面に接触するように注湯した後に冷却して固化させることにより、セラミックス基板の一方の面にアルミニウム回路板を形成して直接接合させる。【選択図】図１
ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
To provide an aluminum-ceramic bonded substrate and method for manufacturing same capable of making aluminum crystal grains fine while maintaining the electric conductivity and Vickers hardness of an aluminum plate to be bonded to a ceramic substrate.SOLUTION: An aluminum-ceramic bonded substrate is manufactured by heating and fusing the solid aluminum and solid Al-Ti-B alloy inputted into a molten-metal holding furnace to obtain a molten metal containing 0.01-0.2 mass% of Ti and 0.001-0.1 mass% of B with a remainder consisting of Al and inevitable impurities, and pouring the molten metal into a mold 10 in a manner contacting one surface of a ceramic substrate arranged therein and thereafter cooling and solidifying it, thereby forming and directly joining an aluminum circuit plate on one surface of the ceramic substrate.SELECTED DRAWING: Figure 1
【課題】セラミックス基板に接合するアルミニウム板の導電率とビッカース硬さを維持しながらアルミニウムの結晶粒を微細化することができる、アルミニウム−セラミックス接合基板およびその製造方法を提供する。【解決手段】溶湯保持炉内に投入した固体のアルミニウムと固体のＡｌ−Ｔｉ−Ｂ合金を加熱して溶融させて、０．０１〜０．２質量％のＴｉと０．００１〜０．１質量％のＢを含み、残部がＡｌと不可避不純物からなる溶湯を得た後、この溶湯を、鋳型１０内に配置されたセラミックス基板の一方の面に接触するように注湯した後に冷却して固化させることにより、セラミックス基板の一方の面にアルミニウム回路板を形成して直接接合させる。【選択図】図１
ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
アルミニウム−セラミックス接合基板およびその製造方法
MARUYAMA TAKAHIRO (author) / YUKI MASAYA (author)
2019-08-29
Patent
Electronic Resource
Japanese
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