A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
The embodiment of the invention provides a loading cavity of semiconductor process equipment. The loading cavity comprises a cavity body, a door body and a sealing ring, the cavity is provided with an opening, the door body located at the door closing position is opposite to the opening, the sealing ring is located in a gap area between the door body and the periphery of the opening, the sealing ring comprises a top end and a bottom end which are far away from each other in the height direction of the sealing ring, and a first sealing cavity is formed in the sealing ring. The first sealing cavity is arranged in the surrounding direction of the sealing ring, the pressure in the first sealing cavity can be adjusted, and the distance between the top end and the bottom end is increased along with the increase of the pressure in the first sealing cavity; the bottom end is arranged on one of the door body and the periphery of the opening, and the top end is used for abutting against the other one of the door body and the periphery of the opening.
本申请实施例提供了一种半导体工艺设备的装载腔室，其包括：腔体、门体和密封环；所述腔体设有开口，处于关门位置的所述门体与所述开口相对，所述密封环位于所述门体与所述开口的外周之间的间隙区域，所述密封环包括沿其自身的高度方向相互远离的顶端和底端，所述密封环内具有第一密封腔，所述第一密封腔沿所述密封环的环绕方向设置，所述第一密封腔的腔内压力可调整，所述顶端与所述底端的间距随所述第一密封腔的腔内压力增大而增大；所述底端设置于所述门体和所述开口的外周中的一者，所述顶端用于抵接于所述门体和所述开口的外周中的另一者。
The embodiment of the invention provides a loading cavity of semiconductor process equipment. The loading cavity comprises a cavity body, a door body and a sealing ring, the cavity is provided with an opening, the door body located at the door closing position is opposite to the opening, the sealing ring is located in a gap area between the door body and the periphery of the opening, the sealing ring comprises a top end and a bottom end which are far away from each other in the height direction of the sealing ring, and a first sealing cavity is formed in the sealing ring. The first sealing cavity is arranged in the surrounding direction of the sealing ring, the pressure in the first sealing cavity can be adjusted, and the distance between the top end and the bottom end is increased along with the increase of the pressure in the first sealing cavity; the bottom end is arranged on one of the door body and the periphery of the opening, and the top end is used for abutting against the other one of the door body and the periphery of the opening.
本申请实施例提供了一种半导体工艺设备的装载腔室，其包括：腔体、门体和密封环；所述腔体设有开口，处于关门位置的所述门体与所述开口相对，所述密封环位于所述门体与所述开口的外周之间的间隙区域，所述密封环包括沿其自身的高度方向相互远离的顶端和底端，所述密封环内具有第一密封腔，所述第一密封腔沿所述密封环的环绕方向设置，所述第一密封腔的腔内压力可调整，所述顶端与所述底端的间距随所述第一密封腔的腔内压力增大而增大；所述底端设置于所述门体和所述开口的外周中的一者，所述顶端用于抵接于所述门体和所述开口的外周中的另一者。
Loading chamber of semiconductor process equipment
半导体工艺设备的装载腔室
SU CHEN (author)
2024-12-17
Patent
Electronic Resource
Chinese
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
E06B
Feste oder bewegliche Abschlüsse für Öffnungen in Bauwerken, Fahrzeugen, Zäunen oder ähnlichen Einfriedungen allgemein, z.B. Türen, Fenster, Läden, Tore
,
FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES, OR LIKE ENCLOSURES, IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
DOOR DRIVING MECHANISM, PROCESS CHAMBER, AND SEMICONDUCTOR PROCESS DEVICE
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