A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CU/CERAMIC BONDED BODY, METHOD FOR MANUFACTURING CU/CERAMIC BONDED BODY, AND POWER MODULE SUBSTRATE
A Cu/ceramic bonded body according to the present invention is formed by bonding a copper member made of copper or a copper alloy and a ceramic member made of AlN or Al 2 O 3 using a bonding material containing Ag and Ti, in which a Ti compound layer made of a Ti nitride or a Ti oxide is formed at a bonding interface between the copper member and the ceramic member, and Ag particles are dispersed in the Ti compound layer.
CU/CERAMIC BONDED BODY, METHOD FOR MANUFACTURING CU/CERAMIC BONDED BODY, AND POWER MODULE SUBSTRATE
A Cu/ceramic bonded body according to the present invention is formed by bonding a copper member made of copper or a copper alloy and a ceramic member made of AlN or Al 2 O 3 using a bonding material containing Ag and Ti, in which a Ti compound layer made of a Ti nitride or a Ti oxide is formed at a bonding interface between the copper member and the ceramic member, and Ag particles are dispersed in the Ti compound layer.
CU/CERAMIC BONDED BODY, METHOD FOR MANUFACTURING CU/CERAMIC BONDED BODY, AND POWER MODULE SUBSTRATE
CU/KERAMIKMATERIALVERBINDUNG, VERFAHREN ZUR HERSTELLUNG EINER CU/KERAMIKMATERIALVERBINDUNG UND SUBSTRAT FÜR LEISTUNGSMODUL
ASSEMBLAGE DE MATÉRIAUX EN CU/CÉRAMIQUE, PROCÉDÉ DE FABRICATION D'ASSEMBLAGE DE MATÉRIAUX EN CU/CÉRAMIQUE, ET SUBSTRAT POUR MODULE DE PUISSANCE
TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author)
2019-11-06
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate
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| European Patent Office | 2021
| European Patent Office | 2020