A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate
A Cu/ceramic bonded body according to the present invention is formed by bonding a copper member made of copper or a copper alloy and a ceramic member made of AlN or Al2O3 using a bonding material containing Ag and Ti, in which a Ti compound layer made of a Ti nitride or a Ti oxide is formed at a bonding interface between the copper member and the ceramic member, and Ag particles are dispersed in the Ti compound layer.
Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate
A Cu/ceramic bonded body according to the present invention is formed by bonding a copper member made of copper or a copper alloy and a ceramic member made of AlN or Al2O3 using a bonding material containing Ag and Ti, in which a Ti compound layer made of a Ti nitride or a Ti oxide is formed at a bonding interface between the copper member and the ceramic member, and Ag particles are dispersed in the Ti compound layer.
Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate
TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author)
2018-07-10
Patent
Electronic Resource
English
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
CU/CERAMIC BONDED BODY, METHOD FOR MANUFACTURING CU/CERAMIC BONDED BODY, AND POWER MODULE SUBSTRATE
| European Patent Office | 2019
| European Patent Office | 2020
| European Patent Office | 2021
| European Patent Office | 2020