A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
PASSAGE MEMBER AND SEMICONDUCTOR MODULE
There are provided a flow passage member having excellent heat dissipation properties and a semiconductor module in which a semiconductor device is mounted on a metal layer disposed on the flow passage member. A flow passage member (1) includes a wall formed of ceramics, a space surrounded by the wall being a flow passage (2) through which a fluid flows, a ratio of an area occupied by a grain boundary phase in an inner surface (3a) of a wall part of the wall in which wall part heat exchange is conducted being smaller than a ratio of an area occupied by a grain boundary phase in an outer surface (3b) of the wall part. The flow passage member (1) configured as described above has excellent heat dissipation properties.
PASSAGE MEMBER AND SEMICONDUCTOR MODULE
There are provided a flow passage member having excellent heat dissipation properties and a semiconductor module in which a semiconductor device is mounted on a metal layer disposed on the flow passage member. A flow passage member (1) includes a wall formed of ceramics, a space surrounded by the wall being a flow passage (2) through which a fluid flows, a ratio of an area occupied by a grain boundary phase in an inner surface (3a) of a wall part of the wall in which wall part heat exchange is conducted being smaller than a ratio of an area occupied by a grain boundary phase in an outer surface (3b) of the wall part. The flow passage member (1) configured as described above has excellent heat dissipation properties.
PASSAGE MEMBER AND SEMICONDUCTOR MODULE
DURCHGANGSELEMENT UND HALBLEITERMODUL
ÉLÉMENT DE PASSAGE ET MODULE À SEMI-CONDUCTEUR
ISHIMINE YUUSAKU (author) / KOMATSUBARA KENJI (author)
2019-02-27
Patent
Electronic Resource
English
GROOVE PASSAGE CONSTITUTION MEMBER AND MANUFACTURING METHOD OF GROOVE PASSAGE CONSTITUTION MEMBER
| European Patent Office | 2024