A platform for research: civil engineering, architecture and urbanism
Flow passage member and semiconductor module
A flow passage member includes a wall formed of ceramics, a space surrounded by the wall being a flow passage through which a fluid flows, a ratio of an area occupied by a grain boundary phase in an inner surface of a wall part of the wall in which wall part heat exchange is conducted being smaller than a ratio of an area occupied by a grain boundary phase in an outer surface of the wall part.
Flow passage member and semiconductor module
A flow passage member includes a wall formed of ceramics, a space surrounded by the wall being a flow passage through which a fluid flows, a ratio of an area occupied by a grain boundary phase in an inner surface of a wall part of the wall in which wall part heat exchange is conducted being smaller than a ratio of an area occupied by a grain boundary phase in an outer surface of the wall part.
Flow passage member and semiconductor module
ISHIMINE YUUSAKU (author) / KOMATSUBARA KENJI (author)
2019-04-16
Patent
Electronic Resource
English
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen