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BONDING COMPOSITION AND METAL BONDED BODY USING SAME
Provided are: a bonding composition which is mainly composed of inorganic particles and is capable of providing a metal bonded body that has high shear strength and long-term reliability; and a metal bonded body using the bonding composition. The present invention relates to a bonding composition which contains inorganic particles and an organic component, and which is characterized in that the sulfur content in the bonding composition is 10% by atom or less relative to the total amount of the inorganic particles and the sulfur.
BONDING COMPOSITION AND METAL BONDED BODY USING SAME
Provided are: a bonding composition which is mainly composed of inorganic particles and is capable of providing a metal bonded body that has high shear strength and long-term reliability; and a metal bonded body using the bonding composition. The present invention relates to a bonding composition which contains inorganic particles and an organic component, and which is characterized in that the sulfur content in the bonding composition is 10% by atom or less relative to the total amount of the inorganic particles and the sulfur.
BONDING COMPOSITION AND METAL BONDED BODY USING SAME
BONDINGZUSAMMENSETZUNG UND GEBONDETER METALLKÖRPER DAMIT
COMPOSITION DE LIAISON ET CORPS LIÉ À UN MÉTAL L'UTILISANT
SHIMOYAMA KENJI (author) / TAKESUE MASAFUMI (author)
2018-01-10
Patent
Electronic Resource
English
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