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    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

    New search for: GUNDEL PAUL
    New search for: MIRIC ANTON
    New search for: BAWOHL MELANIE
    New search for: ZIER GABRIEL
    New search for: HERBST KAI

    Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.

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    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

    New search for: GUNDEL PAUL
    New search for: MIRIC ANTON
    New search for: BAWOHL MELANIE
    New search for: ZIER GABRIEL
    New search for: HERBST KAI

    Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.

    Access

    Download

    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

    New search for: GUNDEL PAUL
    New search for: MIRIC ANTON
    New search for: BAWOHL MELANIE
    New search for: ZIER GABRIEL
    New search for: HERBST KAI

    Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.

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    Download

    Access

    Download

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    Document information
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    Document information
    Title:

    THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

    Additional title:

    DURCH DICKSCHICHTPASTE VERMITTELTE, MIT METALL- ODER METALLHYBRIDFOLIEN VERBUNDENE KERAMIK
    CÉRAMIQUES À MÉDIATION DE PÂTE POUR COUCHES ÉPAISSES LIÉES À DES FEUILLES EN HYBRIDES DE MÉTAL OU EN MÉTAL

    Contributors:

    GUNDEL PAUL (author) / MIRIC ANTON (author) / BAWOHL MELANIE (author) / ZIER GABRIEL (author) / HERBST KAI (author)

    Publication date:

    2023-07-26

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    English

    Classification:

    IPC:  C04B Kalk , LIME / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

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