A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
KUPFER-KERAMIK-SUBSTRAT
The invention relates to a copper-ceramic substrate (1) comprising a ceramic carrier (2), and at least one copper layer structure (3, 4) joined to a surface of the ceramic carrier (2), which has a free surface for forming a conductor structure and/or for securing bonding wires, wherein the copper layer (3, 4) has a microstructure with an average particle size diameter of 200 to 500μm, preferably 300 to 400μm.
KUPFER-KERAMIK-SUBSTRAT
The invention relates to a copper-ceramic substrate (1) comprising a ceramic carrier (2), and at least one copper layer structure (3, 4) joined to a surface of the ceramic carrier (2), which has a free surface for forming a conductor structure and/or for securing bonding wires, wherein the copper layer (3, 4) has a microstructure with an average particle size diameter of 200 to 500μm, preferably 300 to 400μm.
KUPFER-KERAMIK-SUBSTRAT
COPPER-CERAMIC SUBSTRATE
SUBSTRAT CUIVRE-CÉRAMIQUE
LEHMANN HELGE (author) / ZEIGER KARL (author) / CAPPI BENJAMIN (author)
2022-04-20
Patent
Electronic Resource
German