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COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT SUBSTRATE PRODUCTION METHOD
This copper/ceramic bonded body (10) includes: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11) made of silicon nitride, wherein the copper member (12, 13) and the ceramic member (11) are bonded to each other, a Mg-N compound phase (41) extending from a ceramic member (11) side to a copper member (12, 13) side is present at a bonded interface between the copper member (12, 13) and the ceramic member (11), and at least a part of the Mg-N compound phase (41) enters into the copper member (12, 13).
COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT SUBSTRATE PRODUCTION METHOD
This copper/ceramic bonded body (10) includes: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11) made of silicon nitride, wherein the copper member (12, 13) and the ceramic member (11) are bonded to each other, a Mg-N compound phase (41) extending from a ceramic member (11) side to a copper member (12, 13) side is present at a bonded interface between the copper member (12, 13) and the ceramic member (11), and at least a part of the Mg-N compound phase (41) enters into the copper member (12, 13).
COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT SUBSTRATE PRODUCTION METHOD
KUPFER-KERAMIKVERBUNDKÖRPER, ISOLIERSCHALTUNGSSUBSTRAT, VERFAHREN ZUR HERSTELLUNG EINES KUPFER-KERAMIKVERBUNDKÖRPERS UND VERFAHREN ZUR HERSTELLUNG EINES ISOLIERSCHALTUNGSSUBSTRATS
CORPS ASSEMBLÉ CUIVRE/CÉRAMIQUE, SUBSTRAT DE CIRCUIT ISOLANT, PROCÉDÉ DE PRODUCTION DE CORPS ASSEMBLÉ CUIVRE/CÉRAMIQUE ET PROCÉDÉ DE PRODUCTION DE SUBSTRAT DE CIRCUIT ISOLANT
TERASAKI NOBUYUKI (author)
2023-03-22
Patent
Electronic Resource
English
| European Patent Office | 2024
| European Patent Office | 2022
| European Patent Office | 2021
Copper/ceramic joined body and insulating circuit substrate
| European Patent Office | 2024
| European Patent Office | 2021