A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Copper/ceramic joined body and insulating circuit substrate
A copper/ceramic bonded body is provided, including: a copper member made of copper or a copper alloy; and a ceramic member, the copper member and the ceramic member being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %.
Copper/ceramic joined body and insulating circuit substrate
A copper/ceramic bonded body is provided, including: a copper member made of copper or a copper alloy; and a ceramic member, the copper member and the ceramic member being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %.
Copper/ceramic joined body and insulating circuit substrate
TERASAKI NOBUYUKI (author)
2024-10-22
Patent
Electronic Resource
English
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
| European Patent Office | 2022
| European Patent Office | 2021
| European Patent Office | 2024
| European Patent Office | 2023
COPPER-CERAMIC JOINED BODY, AND INSULATION CIRCUIT SUBSTRATE
| European Patent Office | 2020