A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT SUBSTRATE PRODUCTION METHOD
This copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of silicon nitride, wherein the copper member and the ceramic member are bonded to each other, a Mg—N compound phase extending from a ceramic member side to a copper member side is present at a bonded interface between the copper member and the ceramic member, and at least a part of the Mg—N compound phase enters into the copper member.
COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT SUBSTRATE PRODUCTION METHOD
This copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of silicon nitride, wherein the copper member and the ceramic member are bonded to each other, a Mg—N compound phase extending from a ceramic member side to a copper member side is present at a bonded interface between the copper member and the ceramic member, and at least a part of the Mg—N compound phase enters into the copper member.
COPPER/CERAMIC JOINED BODY, INSULATING CIRCUIT SUBSTRATE, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATING CIRCUIT SUBSTRATE PRODUCTION METHOD
TERASAKI NOBUYUKI (author)
2022-07-14
Patent
Electronic Resource
English
| European Patent Office | 2024
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Copper/ceramic joined body and insulating circuit substrate
| European Patent Office | 2024
| European Patent Office | 2021