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COPPER/CERAMIC JOINED BODY AND INSULATIVE CIRCUIT BOARD

TERASAKI NOBUYUKI

A copper/ceramic bonded body (10) is provided, including: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11), the copper member (12, 13) and the ceramic member (11) being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom% or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member (12, 13) and the ceramic member (11) to a copper member (12, 13) side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom%.

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COPPER/CERAMIC JOINED BODY AND INSULATIVE CIRCUIT BOARD

TERASAKI NOBUYUKI

A copper/ceramic bonded body (10) is provided, including: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11), the copper member (12, 13) and the ceramic member (11) being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom% or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member (12, 13) and the ceramic member (11) to a copper member (12, 13) side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom%.

COPPER/CERAMIC JOINED BODY AND INSULATIVE CIRCUIT BOARD

TERASAKI NOBUYUKI

A copper/ceramic bonded body (10) is provided, including: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11), the copper member (12, 13) and the ceramic member (11) being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom% or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member (12, 13) and the ceramic member (11) to a copper member (12, 13) side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom%.

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Titel:

COPPER/CERAMIC JOINED BODY AND INSULATIVE CIRCUIT BOARD

Weitere Titelangaben:

KUPFER/KERAMIK-VERBUNDKÖRPER UND ISOLIERENDE SCHALTUNGSPLATTE
CORPS ASSEMBLÉ EN CUIVRE/CÉRAMIQUE ET CARTE DE CIRCUIT IMPRIMÉ ISOLANTE

Beteiligte:

TERASAKI NOBUYUKI (Autor:in)

Erscheinungsdatum:

04.10.2023

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Englisch

Klassifikation:

IPC: C04B Kalk , LIME / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen

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