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    Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate

    New search for: TONOMURA HIROSHI
    New search for: KITAHARA TAKESHI
    New search for: ISHIZUKA HIROYA
    New search for: KUROMITSU YOSHIROU
    New search for: NAGATOMO YOSHIYUKI

    Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %.

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    Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate

    New search for: TONOMURA HIROSHI
    New search for: KITAHARA TAKESHI
    New search for: ISHIZUKA HIROYA
    New search for: KUROMITSU YOSHIROU
    New search for: NAGATOMO YOSHIYUKI

    Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %.

    Access

    Download

    Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate

    New search for: TONOMURA HIROSHI
    New search for: KITAHARA TAKESHI
    New search for: ISHIZUKA HIROYA
    New search for: KUROMITSU YOSHIROU
    New search for: NAGATOMO YOSHIYUKI

    Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %.

    Access

    Download

    Access

    Download

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate

    Contributors:

    TONOMURA HIROSHI (author) / KITAHARA TAKESHI (author) / ISHIZUKA HIROYA (author) / KUROMITSU YOSHIROU (author) / NAGATOMO YOSHIYUKI (author)

    Publication date:

    2015-07-14

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    English

    Classification:

    IPC:  B44C Verfahren zum Herstellen von Verzierungen , PRODUCING DECORATIVE EFFECTS / B23K Löten , SOLDERING OR UNSOLDERING / C04B Kalk , LIME / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen

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