A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METHOD FOR MANUFACTURING SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT
PROBLEM TO BE SOLVED: To acquire a ceramic member with a flow passage, which is capable of securing airtightness of the junction interface while suppressing deformation of the flow passage.SOLUTION: The manufacturing method includes: a step of preparing unbaked first ceramic molding and second ceramic molding; a step of forming a sheet-like junction layer of higher porosity than that of the first ceramic molding and the like in the first ceramic molding and the like; a step of forming a groove for forming a flow passage to the first ceramic molding; after the step of forming the junction layer and the step of forming the groove, a step of forming a joined body of the first ceramic molding and the second ceramic molding by applying a joint pressure that is lower than a molding pressure of the first ceramic molding and the like with the first ceramic molding and the second ceramic molding facing each other via the junction layer; and a step of forming a ceramic member by baking the joined body.SELECTED DRAWING: Figure 3
【課題】流路の変形を抑制しつつ、接合界面の気密性が確保された、流路付のセラミックス部材を得る。【解決手段】未焼成の第１のセラミックス成形体および第２のセラミックス成形体を準備する工程と、第１のセラミックス成形体等に、第１のセラミックス成形体等より気孔率が高いシート状の接合層を形成する工程と、第１のセラミックス成形体に、流路を構成する溝を形成する工程と、接合層を形成する工程および溝を形成する工程の後に、第１のセラミックス成形体と第２のセラミックス成形体とを接合層を介して対向した状態で、第１のセラミックス成形体等の成形圧力より低い接合圧力で加圧することによって、第１のセラミックス成形体と第２のセラミックス成形体との接合体を形成する工程と、接合体を焼成することによって、セラミックス部材を形成する工程と、を含む。【選択図】図３
METHOD FOR MANUFACTURING SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT
PROBLEM TO BE SOLVED: To acquire a ceramic member with a flow passage, which is capable of securing airtightness of the junction interface while suppressing deformation of the flow passage.SOLUTION: The manufacturing method includes: a step of preparing unbaked first ceramic molding and second ceramic molding; a step of forming a sheet-like junction layer of higher porosity than that of the first ceramic molding and the like in the first ceramic molding and the like; a step of forming a groove for forming a flow passage to the first ceramic molding; after the step of forming the junction layer and the step of forming the groove, a step of forming a joined body of the first ceramic molding and the second ceramic molding by applying a joint pressure that is lower than a molding pressure of the first ceramic molding and the like with the first ceramic molding and the second ceramic molding facing each other via the junction layer; and a step of forming a ceramic member by baking the joined body.SELECTED DRAWING: Figure 3
【課題】流路の変形を抑制しつつ、接合界面の気密性が確保された、流路付のセラミックス部材を得る。【解決手段】未焼成の第１のセラミックス成形体および第２のセラミックス成形体を準備する工程と、第１のセラミックス成形体等に、第１のセラミックス成形体等より気孔率が高いシート状の接合層を形成する工程と、第１のセラミックス成形体に、流路を構成する溝を形成する工程と、接合層を形成する工程および溝を形成する工程の後に、第１のセラミックス成形体と第２のセラミックス成形体とを接合層を介して対向した状態で、第１のセラミックス成形体等の成形圧力より低い接合圧力で加圧することによって、第１のセラミックス成形体と第２のセラミックス成形体との接合体を形成する工程と、接合体を焼成することによって、セラミックス部材を形成する工程と、を含む。【選択図】図３
METHOD FOR MANUFACTURING SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT
半導体製造装置用部品の製造方法
SAKAMAKI RYUNOSUKE (author) / MAEDA TETSUYA (author) / TOSA AKIBUMI (author)
2017-12-28
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURING DEVICE
| European Patent Office | 2021
COMPONENT FOR SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURING METHOD THEREOF
| European Patent Office | 2021
METHOD OF MANUFACTURING COMPONENT FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
| European Patent Office | 2018