A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT
To prevent water from entering the inside of a ceramic member via an external electrode.SOLUTION: A semiconductor manufacturing device component includes a ceramic member and an external electrode arranged to be exposed on the surface side of the ceramic member. In the semiconductor manufacturing device component, the ceramic member has a purity of 99.8% or more of the ceramic material, and the external electrode includes a conductive material, a ceramic material, and glass.SELECTED DRAWING: Figure 2
【課題】水分が外部電極を介してセラミックス部材の内部に浸入することを抑制する。【解決手段】半導体製造装置用部品は、セラミックス部材と、セラミックス部材の表面側に露出するように配置された外部電極と、を備える。半導体製造装置用部品において、セラミックス部材は、セラミックス材料の純度が９９．８％以上であり、外部電極は、導電性材料とセラミックス材料とガラスとを含んでいる。【選択図】図２
SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT
To prevent water from entering the inside of a ceramic member via an external electrode.SOLUTION: A semiconductor manufacturing device component includes a ceramic member and an external electrode arranged to be exposed on the surface side of the ceramic member. In the semiconductor manufacturing device component, the ceramic member has a purity of 99.8% or more of the ceramic material, and the external electrode includes a conductive material, a ceramic material, and glass.SELECTED DRAWING: Figure 2
【課題】水分が外部電極を介してセラミックス部材の内部に浸入することを抑制する。【解決手段】半導体製造装置用部品は、セラミックス部材と、セラミックス部材の表面側に露出するように配置された外部電極と、を備える。半導体製造装置用部品において、セラミックス部材は、セラミックス材料の純度が９９．８％以上であり、外部電極は、導電性材料とセラミックス材料とガラスとを含んでいる。【選択図】図２
SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT
半導体製造装置用部品
TSUJI MASAKI (author) / INUI YASUHIKO (author)
2020-01-09
Patent
Electronic Resource
Japanese
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