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A platform for research: civil engineering, architecture and urbanism
METHOD OF MANUFACTURING COMPONENT FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
PROBLEM TO BE SOLVED: To aim for densification of ceramic member while suppressing warpage.SOLUTION: A method of manufacturing components for semiconductor manufacturing equipment including a tabular ceramic member includes a preparation step of preparing a tabular ceramic compact formed of ceramic, a calcination step of forming a ceramic compact by calcining the ceramic compact, and a load HIP step of forming a ceramic member by performing hot isostatic compression for the ceramic compact, while applying a load to at least one of the first surface of the ceramic compact, and the second surface on the opposite side to the first surface by means of a first compression member.SELECTED DRAWING: Figure 3
【課題】セラミックス部材の緻密化と反り抑制との両立を図る。【解決手段】板状のセラミックス部材を備える半導体製造装置用部品の製造方法であって、セラミックスにより形成された板状のセラミックス成形体を準備する準備工程と、セラミックス成形体を焼成することによって板状のセラミックス焼成体を形成する焼成工程と、セラミックス焼成体の第１の表面と、第１の表面とは反対側の第２の表面との少なくとも一方に対して第１の加圧部材によって荷重を加えつつ、セラミックス焼成体に対して熱間等方加圧を行うことによってセラミックス部材を形成する荷重ＨＩＰ工程と、を含む。【選択図】図３
METHOD OF MANUFACTURING COMPONENT FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
PROBLEM TO BE SOLVED: To aim for densification of ceramic member while suppressing warpage.SOLUTION: A method of manufacturing components for semiconductor manufacturing equipment including a tabular ceramic member includes a preparation step of preparing a tabular ceramic compact formed of ceramic, a calcination step of forming a ceramic compact by calcining the ceramic compact, and a load HIP step of forming a ceramic member by performing hot isostatic compression for the ceramic compact, while applying a load to at least one of the first surface of the ceramic compact, and the second surface on the opposite side to the first surface by means of a first compression member.SELECTED DRAWING: Figure 3
【課題】セラミックス部材の緻密化と反り抑制との両立を図る。【解決手段】板状のセラミックス部材を備える半導体製造装置用部品の製造方法であって、セラミックスにより形成された板状のセラミックス成形体を準備する準備工程と、セラミックス成形体を焼成することによって板状のセラミックス焼成体を形成する焼成工程と、セラミックス焼成体の第１の表面と、第１の表面とは反対側の第２の表面との少なくとも一方に対して第１の加圧部材によって荷重を加えつつ、セラミックス焼成体に対して熱間等方加圧を行うことによってセラミックス部材を形成する荷重ＨＩＰ工程と、を含む。【選択図】図３
METHOD OF MANUFACTURING COMPONENT FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
半導体製造装置用部品の製造方法
TOSA AKIBUMI (author) / WAKAZONO MAKOTO (author) / SAKAMAKI RYUNOSUKE (author)
2018-09-20
Patent
Electronic Resource
Japanese
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