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A platform for research: civil engineering, architecture and urbanism
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURING DEVICE
To suppress a failure of an electric joint between a first front surface of a power supply electrode and an inner peripheral surface of a base part of a power supply terminal.SOLUTION: A manufacturing method of a component for a semiconductor manufacturing device, comprises: a first step of preparing a complex comprising: a first conductive member; a second conductive member; a pre-joint brazed part which is a brazed part before the joining of a first front surface of the first conductive member and a second front surface of the second conductive member; and a ceramic member arranged between the pre-joint brazed part and a screw in a direction orthogonal to the first front surface of the first conductive member in the second front surface of the second conductive member; and a second step of forming the brazed part for joining the first front surface of the first conductive member and the second front surface of the second conductive member by melting the pre-joint brazed part by heating the pre-joint brazed part and hardening the pre-joint brazed part.SELECTED DRAWING: Figure 7
【課題】給電電極の第１の表面と給電端子の基部の内周面との電気的な接合の不良を抑制する。【解決手段】半導体製造装置用部品の製造方法は、第１の導電性部材と、第２の導電性部材と、第１の導電性部材の第１の表面と第２の導電性部材の第２の表面とを接合する前のろう付け部である接合前ろう付け部と、第２の導電性部材の第２の表面の内、第１の導電性部材の第１の表面に直交する方向における接合前ろう付け部とねじとの間に配置されたセラミック部材と、を備える複合体を用意する、第１工程と、接合前ろう付け部を加熱することにより接合前ろう付け部を溶融させ、接合前ろう付け部を硬化させることにより、第１の導電性部材の第１の表面と第２の導電性部材の第２の表面とを接合するろう付け部を形成する、第２工程とを備える。【選択図】図７
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURING DEVICE
To suppress a failure of an electric joint between a first front surface of a power supply electrode and an inner peripheral surface of a base part of a power supply terminal.SOLUTION: A manufacturing method of a component for a semiconductor manufacturing device, comprises: a first step of preparing a complex comprising: a first conductive member; a second conductive member; a pre-joint brazed part which is a brazed part before the joining of a first front surface of the first conductive member and a second front surface of the second conductive member; and a ceramic member arranged between the pre-joint brazed part and a screw in a direction orthogonal to the first front surface of the first conductive member in the second front surface of the second conductive member; and a second step of forming the brazed part for joining the first front surface of the first conductive member and the second front surface of the second conductive member by melting the pre-joint brazed part by heating the pre-joint brazed part and hardening the pre-joint brazed part.SELECTED DRAWING: Figure 7
【課題】給電電極の第１の表面と給電端子の基部の内周面との電気的な接合の不良を抑制する。【解決手段】半導体製造装置用部品の製造方法は、第１の導電性部材と、第２の導電性部材と、第１の導電性部材の第１の表面と第２の導電性部材の第２の表面とを接合する前のろう付け部である接合前ろう付け部と、第２の導電性部材の第２の表面の内、第１の導電性部材の第１の表面に直交する方向における接合前ろう付け部とねじとの間に配置されたセラミック部材と、を備える複合体を用意する、第１工程と、接合前ろう付け部を加熱することにより接合前ろう付け部を溶融させ、接合前ろう付け部を硬化させることにより、第１の導電性部材の第１の表面と第２の導電性部材の第２の表面とを接合するろう付け部を形成する、第２工程とを備える。【選択図】図７
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURING DEVICE
半導体製造装置用部品の製造方法
HIRANAKA AYAKO (author) / YAMAMOTO TAKASHI (author)
2021-02-04
Patent
Electronic Resource
Japanese
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