A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
PROBLEM TO BE SOLVED: To suppress a long period of a manufacturing time of a component for semiconductor manufacturing equipment.SOLUTION: The present invention relates to a manufacturing method of a component for semiconductor manufacturing equipment comprising: an almost flat surface ceramic surface; and a ceramic member in which an electrode is arranged on a bottom surface of a groove part. The manufacturing method of the component for semiconductor manufacturing equipment comprises: a first preparation step of preparing a first ceramic compact 130 in which the electrode is arranged on a first surface 132; a second preparation step of preparing a second ceramic compact 140 in which a concave part 146 is formed on a second surface 144; a crimping step of forming a bonding body 150 of the first ceramic compact and the second ceramic compact by crimping the first and second surfaces by positioning an electrode 44P on the first surface to a position corresponded to the concave part formed on the second surface; and a processing step of processing a third surface 142 of the side opposite to the second surface in a part of the second ceramic compact of the bonding body, and forming the ceramic surface in which a groove part 112 is formed.SELECTED DRAWING: Figure 6
【課題】半導体製造装置用部品の製造時間の長期化を抑制する。【解決手段】略平面状のセラミックス表面を備え、該表面に溝部が形成され、溝部の底面に電極が配置されたセラミックス部材を備える半導体製造装置用部品の製造方法である。第１の表面１３２上に電極が配置された第１のセラミックス成形体１３０を準備する第１の準備工程と、第２の表面１４４に凹部１４６が形成された第２のセラミックス成形体１４０を準備する第２の準備工程と、第１の表面上の電極４４Ｐを、第２の表面に形成された凹部に対応する位置に合わせ、第１の表面と第２の表面とを圧着させることにより、第１のセラミックス成形体と第２のセラミックス成形体との接合体１５０を形成する圧着工程と、接合体のうち、第２のセラミックス成形体の部分における第２の表面とは反対側の第３の表面１４２側を加工して、溝部１１２が形成されたセラミックス表面を形成する加工工程と、を含む。【選択図】図６
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
PROBLEM TO BE SOLVED: To suppress a long period of a manufacturing time of a component for semiconductor manufacturing equipment.SOLUTION: The present invention relates to a manufacturing method of a component for semiconductor manufacturing equipment comprising: an almost flat surface ceramic surface; and a ceramic member in which an electrode is arranged on a bottom surface of a groove part. The manufacturing method of the component for semiconductor manufacturing equipment comprises: a first preparation step of preparing a first ceramic compact 130 in which the electrode is arranged on a first surface 132; a second preparation step of preparing a second ceramic compact 140 in which a concave part 146 is formed on a second surface 144; a crimping step of forming a bonding body 150 of the first ceramic compact and the second ceramic compact by crimping the first and second surfaces by positioning an electrode 44P on the first surface to a position corresponded to the concave part formed on the second surface; and a processing step of processing a third surface 142 of the side opposite to the second surface in a part of the second ceramic compact of the bonding body, and forming the ceramic surface in which a groove part 112 is formed.SELECTED DRAWING: Figure 6
【課題】半導体製造装置用部品の製造時間の長期化を抑制する。【解決手段】略平面状のセラミックス表面を備え、該表面に溝部が形成され、溝部の底面に電極が配置されたセラミックス部材を備える半導体製造装置用部品の製造方法である。第１の表面１３２上に電極が配置された第１のセラミックス成形体１３０を準備する第１の準備工程と、第２の表面１４４に凹部１４６が形成された第２のセラミックス成形体１４０を準備する第２の準備工程と、第１の表面上の電極４４Ｐを、第２の表面に形成された凹部に対応する位置に合わせ、第１の表面と第２の表面とを圧着させることにより、第１のセラミックス成形体と第２のセラミックス成形体との接合体１５０を形成する圧着工程と、接合体のうち、第２のセラミックス成形体の部分における第２の表面とは反対側の第３の表面１４２側を加工して、溝部１１２が形成されたセラミックス表面を形成する加工工程と、を含む。【選択図】図６
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
半導体製造装置用部品の製造方法
TSUJITA MASAO (author) / TANAKA KAZUTAKA (author) / KURANO JUN (author)
2018-11-15
Patent
Electronic Resource
Japanese
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