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PELLICLE FRAME AND PRODUCTION METHOD THEREOF
To provide a pellicle frame and a production method thereof, which can suppress the generation of particles.SOLUTION: Since an inside member 25 that constitutes an inside surface 23 of a bottom hole 17 of a pellicle frame 1 is formed of a material (a resin, for example, such as an epoxy resin) having the hardness lower than a material that constitutes a frame body 2 of the pellicle frame, even when, for example, a stainless tool pin 19 is frequently inserted in and removed from the bottom hole 17 and the tool pin 19 comes into contact frequently with the inside member 25, the tool pin 19 is difficult to be worn. Therefore, since generation of particles due to wear of the tool pin 19 can be suppressed, when producing, for example, semiconductor components, generation of defect of a wiring pattern can be suppressed. Furthermore, the frequency of exchange of the tool pin 19 can be reduced.SELECTED DRAWING: Figure 5
【課題】パーティクルの発生を抑制できるペリクル枠及びその製造方法を提供すること。【解決手段】ペリクル枠1の有底孔17の内周面23を構成する内側部材25は、ペリクル枠1の枠体2を構成する材料よりも硬度が低い材料(例えばエポキシ樹脂等の樹脂)からなるので、有底孔17に例えばステンレス製の治具ピン19が何度も抜き差しされて、治具ピン19が何度も内側部材25に接触した場合でも、治具ピン19が摩耗しにくい。そのため、治具ピン19の摩耗によるパーティクルの発生を抑制できるので、例えば半導体部品の製造時おける配線パターンの欠陥の発生を抑制できる。また、治具ピン19の交換頻度を低減できる。【選択図】図5
PELLICLE FRAME AND PRODUCTION METHOD THEREOF
To provide a pellicle frame and a production method thereof, which can suppress the generation of particles.SOLUTION: Since an inside member 25 that constitutes an inside surface 23 of a bottom hole 17 of a pellicle frame 1 is formed of a material (a resin, for example, such as an epoxy resin) having the hardness lower than a material that constitutes a frame body 2 of the pellicle frame, even when, for example, a stainless tool pin 19 is frequently inserted in and removed from the bottom hole 17 and the tool pin 19 comes into contact frequently with the inside member 25, the tool pin 19 is difficult to be worn. Therefore, since generation of particles due to wear of the tool pin 19 can be suppressed, when producing, for example, semiconductor components, generation of defect of a wiring pattern can be suppressed. Furthermore, the frequency of exchange of the tool pin 19 can be reduced.SELECTED DRAWING: Figure 5
【課題】パーティクルの発生を抑制できるペリクル枠及びその製造方法を提供すること。【解決手段】ペリクル枠1の有底孔17の内周面23を構成する内側部材25は、ペリクル枠1の枠体2を構成する材料よりも硬度が低い材料(例えばエポキシ樹脂等の樹脂)からなるので、有底孔17に例えばステンレス製の治具ピン19が何度も抜き差しされて、治具ピン19が何度も内側部材25に接触した場合でも、治具ピン19が摩耗しにくい。そのため、治具ピン19の摩耗によるパーティクルの発生を抑制できるので、例えば半導体部品の製造時おける配線パターンの欠陥の発生を抑制できる。また、治具ピン19の交換頻度を低減できる。【選択図】図5
PELLICLE FRAME AND PRODUCTION METHOD THEREOF
ペリクル枠及びその製造方法
KIMURA YUKIHIRO (author)
2018-12-06
Patent
Electronic Resource
Japanese
IPC:
G03F
Fotomechanische Herstellung strukturierter oder gemusterter Oberflächen, z.B. zum Drucken, zum Herstellen von Halbleiterbauelementen
,
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
/
B23H
Metallbearbeitung durch Einwirkung elektrischen Stromes hoher Stromdichte auf ein Werkstück unter Benutzung einer Elektrode anstelle eines Werkzeugs
,
WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL
/
C04B
Kalk
,
LIME
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