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A platform for research: civil engineering, architecture and urbanism
MATERIAL POWDER FOR ADDITIONAL MOLDING, STRUCTURE, SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT, AND SEMICONDUCTOR MANUFACTURING DEVICE
To provide material powder for additional molding made of an eutectic oxide in which density is reduced.SOLUTION: Provided is material powder for additional molding for obtaining a structure by repeating sintering or melting and solidifying to powder by the irradiation of an energy beam, including a nitride and an eutectic oxide, and the average density of the nitride is lower than the average density of the eutectic oxide.SELECTED DRAWING: Figure 3
【課題】 密度が低減された、共晶系酸化物からなる付加造形用材料粉末を提供する。【解決手段】 エネルギービームを照射して粉末を焼結ないし熔融、凝固させることを繰り返すことで構造物を得るための本発明の付加造形用の材料粉末は窒化物と共晶系酸化物とを含有し、前記窒化物の平均密度が前記共晶系酸化物の平均密度より低いことを特徴とする。【選択図】図３
MATERIAL POWDER FOR ADDITIONAL MOLDING, STRUCTURE, SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT, AND SEMICONDUCTOR MANUFACTURING DEVICE
To provide material powder for additional molding made of an eutectic oxide in which density is reduced.SOLUTION: Provided is material powder for additional molding for obtaining a structure by repeating sintering or melting and solidifying to powder by the irradiation of an energy beam, including a nitride and an eutectic oxide, and the average density of the nitride is lower than the average density of the eutectic oxide.SELECTED DRAWING: Figure 3
【課題】 密度が低減された、共晶系酸化物からなる付加造形用材料粉末を提供する。【解決手段】 エネルギービームを照射して粉末を焼結ないし熔融、凝固させることを繰り返すことで構造物を得るための本発明の付加造形用の材料粉末は窒化物と共晶系酸化物とを含有し、前記窒化物の平均密度が前記共晶系酸化物の平均密度より低いことを特徴とする。【選択図】図３
MATERIAL POWDER FOR ADDITIONAL MOLDING, STRUCTURE, SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT, AND SEMICONDUCTOR MANUFACTURING DEVICE
付加造形用の材料粉末、構造物、半導体製造装置部品、および半導体製造装置
YASUI NOBUHIRO (author) / YABUTA HISATO (author) / OSHIMA KANAKO (author)
2019-06-06
Patent
Electronic Resource
Japanese
IPC:
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
/
C04B
Kalk
,
LIME
/
H01L
Halbleiterbauelemente
,
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