A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
ELECTRIC CIRCUIT BOARD AND POWER MODULE
To improve heat radiation properties and low thermal stress properties of an electric circuit board.SOLUTION: An electric circuit board 10 comprises: an insulating substrate 1 that has a first principal surface 1A and a second principal surface 1B; a metal member 2; and a heat conduction member g1. The metal member joined to the first principal surface includes a first metal member 2A and a second metal member 2B that are separated across a gap a1 along a direction parallel to the first principal surface. The metal member joined to the second principal surface includes a third metal member 2D arranged at a position on the opposite side of the first metal member, and a fourth metal member 2E arranged at a position on the opposite side of the second metal member. The third metal member and the fourth metal member are joined to a heat conduction member arranged at a position on the opposite side of the gap. The heat conduction member (graphite) has properties including a larger thermal conductivity than that of the metal member and a smaller thermal expansivity than that of the metal member, with respect to at least a direction (X) separating the third metal member and the fourth metal member from each other.SELECTED DRAWING: Figure 1
【課題】電気回路基板の放熱性、低熱応力性を向上する。【解決手段】電気回路基板１０は、第一主面１Ａと第二主面１Ｂとを有する絶縁基板１と、金属部材２と、熱伝導部材ｇ１とを備える。第一主面に接合した金属部材は、第一主面に平行な方向に沿って間隙ａ１を介して隔てられた第一金属部材２Ａと第二金属部材２Ｂとを含む。第二主面に接合した金属部材は、第一金属部材に対する反対側の位置に配置された第三金属部材２Ｄと、第二金属部材に対する反対側の位置に配置された第四金属部材２Ｅとを含む。第三金属部材及び第四金属部材は、間隙に対する反対側の位置に配置された熱伝導部材に接合する。熱伝導部材（グラファイト等）は、少なくとも前記第三金属部材と第四金属部材とを隔てる方向（Ｘ）について、熱伝導率が金属部材より大きく、熱膨張率が金属部材よりも小さい特性を有する。【選択図】図１
ELECTRIC CIRCUIT BOARD AND POWER MODULE
To improve heat radiation properties and low thermal stress properties of an electric circuit board.SOLUTION: An electric circuit board 10 comprises: an insulating substrate 1 that has a first principal surface 1A and a second principal surface 1B; a metal member 2; and a heat conduction member g1. The metal member joined to the first principal surface includes a first metal member 2A and a second metal member 2B that are separated across a gap a1 along a direction parallel to the first principal surface. The metal member joined to the second principal surface includes a third metal member 2D arranged at a position on the opposite side of the first metal member, and a fourth metal member 2E arranged at a position on the opposite side of the second metal member. The third metal member and the fourth metal member are joined to a heat conduction member arranged at a position on the opposite side of the gap. The heat conduction member (graphite) has properties including a larger thermal conductivity than that of the metal member and a smaller thermal expansivity than that of the metal member, with respect to at least a direction (X) separating the third metal member and the fourth metal member from each other.SELECTED DRAWING: Figure 1
【課題】電気回路基板の放熱性、低熱応力性を向上する。【解決手段】電気回路基板１０は、第一主面１Ａと第二主面１Ｂとを有する絶縁基板１と、金属部材２と、熱伝導部材ｇ１とを備える。第一主面に接合した金属部材は、第一主面に平行な方向に沿って間隙ａ１を介して隔てられた第一金属部材２Ａと第二金属部材２Ｂとを含む。第二主面に接合した金属部材は、第一金属部材に対する反対側の位置に配置された第三金属部材２Ｄと、第二金属部材に対する反対側の位置に配置された第四金属部材２Ｅとを含む。第三金属部材及び第四金属部材は、間隙に対する反対側の位置に配置された熱伝導部材に接合する。熱伝導部材（グラファイト等）は、少なくとも前記第三金属部材と第四金属部材とを隔てる方向（Ｘ）について、熱伝導率が金属部材より大きく、熱膨張率が金属部材よりも小さい特性を有する。【選択図】図１
ELECTRIC CIRCUIT BOARD AND POWER MODULE
電気回路基板及びパワーモジュール
HORINOUCHI NAOKI (author)
2020-07-09
Patent
Electronic Resource
Japanese
CIRCUIT BOARD MANUFACTURING METHOD, CIRCUIT BOARD, AND POWER MODULE
| European Patent Office | 2024
| European Patent Office | 2017