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COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic assembly excellent in cooling/heating cycle reliability, capable of suppressing occurrence of cracks in a ceramic member even when loaded with a harsh cooling/heating cycle.SOLUTION: Copper members 12 and 13 are bonded to one face and another face of a ceramic member 11, respectively. The copper members 12 and 13 have active metal diffusion zones 23 and 33 with an active metal content of 0.5 mass% or more in the copper members 12 and 13, on the ceramic member 11 side, respectively. The maximum arrival distance L1 of the active metal diffusion zone 23 on the one face and the maximum arrival distance L2 of the active metal diffusion zone 33 on the other face are in the range of 20 μm or more and 80 μm, and the difference between the maximum arrival distance L1 and the maximum arrival distance L2 is 10 μm or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】セラミックス部材１１の一方の面および他方の面にそれぞれ銅部材１２，１３が接合されており、銅部材１２，１３のうちセラミックス部材１１側には、銅部材１２，１３中の活性金属の濃度が０．５質量％以上である活性金属拡散領域２３，３３が形成されており、一方の面側の活性金属拡散領域２３の最大到達距離Ｌ１、および、他方の面側の活性金属拡散領域３３の最大到達距離Ｌ２が２０μｍ以上８０μｍ以下の範囲内とされるとともに、最大到達距離Ｌ１と最大到達距離Ｌ２との差が１０μｍ以下である。【選択図】図２
COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic assembly excellent in cooling/heating cycle reliability, capable of suppressing occurrence of cracks in a ceramic member even when loaded with a harsh cooling/heating cycle.SOLUTION: Copper members 12 and 13 are bonded to one face and another face of a ceramic member 11, respectively. The copper members 12 and 13 have active metal diffusion zones 23 and 33 with an active metal content of 0.5 mass% or more in the copper members 12 and 13, on the ceramic member 11 side, respectively. The maximum arrival distance L1 of the active metal diffusion zone 23 on the one face and the maximum arrival distance L2 of the active metal diffusion zone 33 on the other face are in the range of 20 μm or more and 80 μm, and the difference between the maximum arrival distance L1 and the maximum arrival distance L2 is 10 μm or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】セラミックス部材１１の一方の面および他方の面にそれぞれ銅部材１２，１３が接合されており、銅部材１２，１３のうちセラミックス部材１１側には、銅部材１２，１３中の活性金属の濃度が０．５質量％以上である活性金属拡散領域２３，３３が形成されており、一方の面側の活性金属拡散領域２３の最大到達距離Ｌ１、および、他方の面側の活性金属拡散領域３３の最大到達距離Ｌ２が２０μｍ以上８０μｍ以下の範囲内とされるとともに、最大到達距離Ｌ１と最大到達距離Ｌ２との差が１０μｍ以下である。【選択図】図２
COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TERASAKI NOBUYUKI (author)
2022-10-31
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2021