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COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic assembly excellent in cooling/heating cycle reliability, capable of suppressing occurrence of cracks in a ceramic member even when loaded with a harsh cooling/heating cycle.SOLUTION: Copper members 12 and 13 are bonded to one face and another face of a ceramic member 11, respectively. The copper members 12 and 13 have active metal nitride layers 21 and 31 on the ceramic member 11 side, respectively. The area ratios A1 and A2 of an active metal compound containing Si and an active metal in regions E1 and E2 with a depth of 10 μm from the active metal nitride layers 21 and 31 to the respective copper members 12 and 13 sides are 10% or less. The ratio A1/A2 between the area ratio A1 of the active metal compound on the one face and the area ratio A2 of the active metal compound on the other face is in the range of 0.7 or more and 1.4 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】セラミックス部材１１の一方の面および他方の面にそれぞれ銅部材１２，１３が接合されており、銅部材１２，１３のうちセラミックス部材１１側には、活性金属窒化物層２１，３１が形成されており、活性金属窒化物層２１，３１から銅部材１２，１３側へ１０μｍの領域Ｅ１，Ｅ２におけるＳｉと活性金属とを含む活性金属化合物の面積率Ａ１，Ａ２が１０％以下とされており、一方の面側の前記活性金属化合物の面積率Ａ１と、前記他方の面側の前記活性金属化合物の面積率Ａ２との比Ａ１／Ａ２が、０．７以上１．４以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic assembly excellent in cooling/heating cycle reliability, capable of suppressing occurrence of cracks in a ceramic member even when loaded with a harsh cooling/heating cycle.SOLUTION: Copper members 12 and 13 are bonded to one face and another face of a ceramic member 11, respectively. The copper members 12 and 13 have active metal nitride layers 21 and 31 on the ceramic member 11 side, respectively. The area ratios A1 and A2 of an active metal compound containing Si and an active metal in regions E1 and E2 with a depth of 10 μm from the active metal nitride layers 21 and 31 to the respective copper members 12 and 13 sides are 10% or less. The ratio A1/A2 between the area ratio A1 of the active metal compound on the one face and the area ratio A2 of the active metal compound on the other face is in the range of 0.7 or more and 1.4 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】セラミックス部材１１の一方の面および他方の面にそれぞれ銅部材１２，１３が接合されており、銅部材１２，１３のうちセラミックス部材１１側には、活性金属窒化物層２１，３１が形成されており、活性金属窒化物層２１，３１から銅部材１２，１３側へ１０μｍの領域Ｅ１，Ｅ２におけるＳｉと活性金属とを含む活性金属化合物の面積率Ａ１，Ａ２が１０％以下とされており、一方の面側の前記活性金属化合物の面積率Ａ１と、前記他方の面側の前記活性金属化合物の面積率Ａ２との比Ａ１／Ａ２が、０．７以上１．４以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TERASAKI NOBUYUKI (author)
2022-10-31
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2021