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COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic assembly excellent in cooling/heating cycle reliability, capable of suppressing occurrence of cracks in a ceramic member even when loaded with a harsh cooling/heating cycle.SOLUTION: Copper members 12 and 13 are bonded to one face and another face of a ceramic member 11, respectively. At the joint interfaces between the ceramic member 11 and the copper members 12 and 13, the maximum value of indentation hardness in a region from 10 μm to 50 μm from the interface between active metal compound layers 21 and 31 and the copper members 12 and 13 to the copper members 12 and 13 sides is 120 mgf/μm2 or more and 200 mgf/μm2 or less. The difference between the maximum value H1 of the indentation hardness of the copper member 12 bonded to the one face and the maximum value H2 of the indentation hardness of the copper member 13 bonded to the other face is 50 mgf/μm2 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】セラミックス部材１１の一方の面および他方の面にそれぞれ銅部材１２，１３が接合されており、セラミックス部材１１と銅部材１２，１３との接合界面において、活性金属化合物層２１，３１の銅部材１２，１３との界面から銅部材１２，１３側へ１０μｍから５０μｍまでの領域におけるインデンテーション硬さの最大値が１２０ｍｇｆ／μｍ２以上２００ｍｇｆ／μｍ２以下の範囲内とされ、一方の面側に接合された銅部材１２におけるインデンテーション硬さの最大値Ｈ１と、他方の面側に接合された銅部材１３におけるインデンテーション硬さの最大値Ｈ２との差が５０ｍｇｆ／μｍ２以下である。【選択図】図２
COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD
To provide a copper/ceramic assembly excellent in cooling/heating cycle reliability, capable of suppressing occurrence of cracks in a ceramic member even when loaded with a harsh cooling/heating cycle.SOLUTION: Copper members 12 and 13 are bonded to one face and another face of a ceramic member 11, respectively. At the joint interfaces between the ceramic member 11 and the copper members 12 and 13, the maximum value of indentation hardness in a region from 10 μm to 50 μm from the interface between active metal compound layers 21 and 31 and the copper members 12 and 13 to the copper members 12 and 13 sides is 120 mgf/μm2 or more and 200 mgf/μm2 or less. The difference between the maximum value H1 of the indentation hardness of the copper member 12 bonded to the one face and the maximum value H2 of the indentation hardness of the copper member 13 bonded to the other face is 50 mgf/μm2 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】セラミックス部材１１の一方の面および他方の面にそれぞれ銅部材１２，１３が接合されており、セラミックス部材１１と銅部材１２，１３との接合界面において、活性金属化合物層２１，３１の銅部材１２，１３との界面から銅部材１２，１３側へ１０μｍから５０μｍまでの領域におけるインデンテーション硬さの最大値が１２０ｍｇｆ／μｍ２以上２００ｍｇｆ／μｍ２以下の範囲内とされ、一方の面側に接合された銅部材１２におけるインデンテーション硬さの最大値Ｈ１と、他方の面側に接合された銅部材１３におけるインデンテーション硬さの最大値Ｈ２との差が５０ｍｇｆ／μｍ２以下である。【選択図】図２
COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TERASAKI NOBUYUKI (author)
2022-10-31
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2021