A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
MANUFACTURING METHOD FOR A MEMBER FOR A SEMICONDUCTOR MANUFACTURING DEVICE AND MEMBER FOR A SEMICONDUCTOR MANUFACTURING DEVICE
In a manufacturing method for a member for a semiconductor manufacturing device, a metal terminal and a ceramic member are joined by using a paste that contains a resin and a metal particle(s), and a metal fine particle(s) that has/have a particle size(s) of 100 nm or less in the metal particle(s) account(s) for 1% by mass or more of 100% by mass of the metal particle(s). A member for a semiconductor manufacturing device includes a metal terminal, a ceramic member, and a joining part that connects the metal terminal and the ceramic member. The joining part contains a metal particle(s).
MANUFACTURING METHOD FOR A MEMBER FOR A SEMICONDUCTOR MANUFACTURING DEVICE AND MEMBER FOR A SEMICONDUCTOR MANUFACTURING DEVICE
In a manufacturing method for a member for a semiconductor manufacturing device, a metal terminal and a ceramic member are joined by using a paste that contains a resin and a metal particle(s), and a metal fine particle(s) that has/have a particle size(s) of 100 nm or less in the metal particle(s) account(s) for 1% by mass or more of 100% by mass of the metal particle(s). A member for a semiconductor manufacturing device includes a metal terminal, a ceramic member, and a joining part that connects the metal terminal and the ceramic member. The joining part contains a metal particle(s).
MANUFACTURING METHOD FOR A MEMBER FOR A SEMICONDUCTOR MANUFACTURING DEVICE AND MEMBER FOR A SEMICONDUCTOR MANUFACTURING DEVICE
SEKIGUCHI KEIICHI (author) / MUNEISHI TAKESHI (author)
2021-08-19
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
| European Patent Office | 2025
| European Patent Office | 2022